SCHEMBL1784680

SCHEMBL1784680

C=CC[Si](C)(OC(C)C)OC(C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Bromide SCHEMBL28757268 0.98
SCHEMBL3626277 0.80
SCHEMBL5411239 0.79
SCHEMBL2396715 0.79
SCHEMBL5179618 0.77
SCHEMBL545662 0.77
SCHEMBL2240558 0.73 TSHR (0.36)
SCHEMBL27722683 0.71
SCHEMBL13089293 0.71
SCHEMBL319670 0.70

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-101639628-B Radioactive linear composition for forming of coloring layer, color filter and color liquid crystal display element JSR CORP JP 2013-04-03 CN disclosed
CN-101646718-B Curable resin composition, protective film, and method for forming protective film JSR CORP JP 2013-04-03 CN disclosed
CN-101324755-B Radiation sensitive resin composition, interlayer dielectric and microlens, and method for producing thereof JSR CORP 2012-10-03 CN disclosed
CN-101226329-B Radiation sensitive resin composition, laminated insulating film, micro lens and preparation method thereof JSR CORP 2012-09-05 CN disclosed
US-8247590-B2 Method for preventing polymerization of unsaturated organosilicon compounds WACKER CHEMIE AG (DE) 2012-08-21 US disclosed
CN-101646959-B Lens NIPPON STEEL CHEMICAL CO 2012-06-27 CN disclosed
CN-101410437-B Curable resin, curable resin compositions and moldings thereof NIPPON STEEL CHEMICAL CO 2012-01-04 CN disclosed
US-20110118493-A1 METHOD FOR PREVENTING POLYMERIZATION OF UNSATURATED ORGANOSILICON COMPOUNDS WACKER CHEMIE AG (DE) 2011-05-19 US disclosed
CN-101174053-B Display device NIPPON STEEL CHEMICAL CO 2011-04-20 CN disclosed
EP-1194475-B1 WATERBORNE SILICONE ADHESIVES, SEALANTS AND COATINGS MOMENTIVE PERFORMANCE MAT INC (US) 2010-08-04 EP disclosed
CN-101324755-A Radiation sensitive resin composition, interlayer dielectric and microlens, and method for producing thereof JSR CORP (JP) 2008-12-17 CN disclosed
CN-101226329-A Radiation sensitive resin composition, laminated insulating film, micro lens and preparation method thereof JSR CORP (JP) 2008-07-23 CN disclosed
CN-101174053-A Display device NIPPON STEEL CHEMICAL CO (JP) 2008-05-07 CN disclosed
US-7291567-B2 Silica-based film, method of forming the same, composition for forming insulating film for semiconductor device, interconnect structure, and semiconductor device JSR CORPORATION (JP) 2007-11-06 US disclosed
US-7193026-B2 Organosilicon compound-curing composition and silicone-base coating composition SHIN-ETSU CHEMICAL CO., LTD. (JP) 2007-03-20 US disclosed
EP-1619226-A1 Silica-based film, method of forming the same, composition for forming insulating film for semiconductor device, interconnect structure, and semiconductor device JSR Corporation (JP) 2006-01-25 EP disclosed
US-20040260048-A1 Organosilicon compound - curing composition and silicone-base coating composition SHIN-ETSU CHEMICAL CO., LTD. (JP) 2004-12-23 US disclosed
EP-1194475-A1 WATERBORNE SILICONE ADHESIVES, SEALANTS AND COATINGS Crompton Corporation (US) 2002-04-10 EP disclosed
US-6319982-B1 POLYMER/CROSSLINKING SYSTEM WHICH IS COMPOSED OF A SELF CROSSLINKING RESIN COMPRISED OF A SILICONE FLUID MODIFIED WITH PENDANT OR TERMINAL SILANES CONTAINING HINDERED ALKOXY GROUPS CK WITCO CORPORATION 2001-11-20 US disclosed
WO-2001000711-A1 WATERBORNE SILICONE ADHESIVES, SEALANTS AND COATINGS CROMPTON CORPORATION (US) 2001-01-04 WO disclosed