SCHEMBL1784684

SCHEMBL1784684

C=CCC[SiH](OC(C)C)OC(C)C

nearest known ligand 0.32

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
TSHR P16473 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2240636 0.86 TSHR (0.37) TSHR
SCHEMBL2240562 0.85 TSHR (0.38) TSHR
SCHEMBL5411245 0.80 TSHR (0.33) TSHR
SCHEMBL2396719 0.80
SCHEMBL13089487 0.76
SCHEMBL1782285 0.75
SCHEMBL5834049 0.73 TSHR (0.38) TSHR
SCHEMBL143502 0.72
SCHEMBL4077511 0.72
SCHEMBL737353 0.72

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8247590-B2 Method for preventing polymerization of unsaturated organosilicon compounds WACKER CHEMIE AG (DE) 2012-08-21 US disclosed
US-7994250-B2 Vinyl-urethane copolymers with intermediary linkage segments having silicon-oxygen bonds and production methods thereof KONISHI CO., LTD. (JP) 2011-08-09 US disclosed
US-20110118493-A1 METHOD FOR PREVENTING POLYMERIZATION OF UNSATURATED ORGANOSILICON COMPOUNDS WACKER CHEMIE AG (DE) 2011-05-19 US disclosed
EP-1194475-B1 WATERBORNE SILICONE ADHESIVES, SEALANTS AND COATINGS MOMENTIVE PERFORMANCE MAT INC (US) 2010-08-04 EP disclosed
US-20090326151-A1 HAIR COSMETIC KONISHI CO., LTD. (JP) 2009-12-31 US disclosed
EP-2039347-A1 COSMETIC HAIR PREPARATION Shiseido Company, Limited (JP) 2009-03-25 EP disclosed
US-7291567-B2 Silica-based film, method of forming the same, composition for forming insulating film for semiconductor device, interconnect structure, and semiconductor device JSR CORPORATION (JP) 2007-11-06 US disclosed
EP-1837360-A1 VINYL-URETHANE COPOLYMER AND METHOD FOR PRODUCING SAME Konishi Co., Ltd. (JP) 2007-09-26 EP disclosed
US-20070117902-A1 Vinyl-urethane copolymers and production methods thereof KONISHI CO., LTD. (JP) 2007-05-24 US disclosed
US-7005532-B2 Process of producing alkoxysilanes TOAGOSEI CO., LTD. (JP) 2006-02-28 US disclosed
EP-1428828-A1 PROCESS FOR PREPARATION OF ALKOXYSILANES TOAGOSEI CO., LTD. (JP) 2004-06-16 EP disclosed
EP-1194475-A1 WATERBORNE SILICONE ADHESIVES, SEALANTS AND COATINGS Crompton Corporation (US) 2002-04-10 EP disclosed
US-6319982-B1 POLYMER/CROSSLINKING SYSTEM WHICH IS COMPOSED OF A SELF CROSSLINKING RESIN COMPRISED OF A SILICONE FLUID MODIFIED WITH PENDANT OR TERMINAL SILANES CONTAINING HINDERED ALKOXY GROUPS CK WITCO CORPORATION 2001-11-20 US disclosed
WO-2001000711-A1 WATERBORNE SILICONE ADHESIVES, SEALANTS AND COATINGS CROMPTON CORPORATION (US) 2001-01-04 WO disclosed
EP-0433727-B1 Silica-core silicone-shell particles, emulsion containing the same dispersed therein, and process for producing the emulsion TOSHIBA SILICONE (JP) 1995-08-02 EP disclosed
EP-0433906-B1 Thermoplastic resin and process for producing the same TOSHIBA SILICONE (JP) 1995-07-26 EP disclosed
US-5218014-A Graft polymer formed by graft polymerization of vinyl monomer onto colloidal silica core silicone shell particles TOSHIBA SILICONE CO., LTD. (JP) 1993-06-08 US disclosed
US-5188899-A SILICA-CORE SILICONE-SHELL PARTICLES, EMULSION CONTAINING THE SAME DISPERSED THEREIN, AND PROCESS FOR PRODUCING THE EMULSION TOSHIBA SILICONE CO., LTD. (JP) 1993-02-23 US disclosed
EP-0433906-A2 Thermoplastic resin and process for producing the same TOSHIBA SILICONE CO., LTD. (JP) 1991-06-26 EP disclosed
EP-0433727-A1 Silica-core silicone-shell particles, emulsion containing the same dispersed therein, and process for producing the emulsion TOSHIBA SILICONE CO., LTD. (JP) 1991-06-26 EP disclosed