⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL19019958 | 0.87 | — | — | |
| SCHEMBL2023042 | 0.87 | — | — | |
| SCHEMBL30422625 | 0.87 | — | — | |
| SCHEMBL316188 | 0.87 | — | — | |
| SCHEMBL31295344 | 0.87 | — | — | |
| SCHEMBL62196 | 0.87 | — | — | |
| SCHEMBL2398987 | 0.87 | — | — | |
| Lithium Ion SCHEMBL15843909 | 0.75 | — | — | |
| SCHEMBL1877604 | 0.75 | — | — | |
| SCHEMBL7051864 | 0.75 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-9972410-B2 | Ti-included oxide dispersion strengthened copper alloy and method for manufacturing dispersed copper | KOREA INSTITUTE OF MACHINERY & MATERIALS (KR) | 2018-05-15 | — | — | US | claimed |
| US-20160189820-A1 | Ti-INCLUDED OXIDE DISPERSION STRENGTHENED COPPER ALLOY AND METHOD FOR MANUFACTURING DISPERSED COPPER | KOREA INSTITUTE OF MATERIALS SCIENCE (KR) | 2016-06-30 | — | — | US | claimed |
| US-9972410-B2 | Ti-included oxide dispersion strengthened copper alloy and method for manufacturing dispersed copper | KOREA INSTITUTE OF MACHINERY & MATERIALS (KR) | 2018-05-15 | — | — | US | disclosed |
| US-20160189820-A1 | Ti-INCLUDED OXIDE DISPERSION STRENGTHENED COPPER ALLOY AND METHOD FOR MANUFACTURING DISPERSED COPPER | KOREA INSTITUTE OF MATERIALS SCIENCE (KR) | 2016-06-30 | — | — | US | disclosed |