SCHEMBL17879941

SCHEMBL17879941

COCCOCCOc1ccc(C(=O)c2ccc(C)cc2)cc1

nearest known ligand 0.55

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
▸ NPC1 O15118 3/20 0.55
▸ MAPT P10636 5/20 0.51
▸ L3MBTL1 Q9Y468 5/20 0.51
▸ LMNA P02545 4/20 0.51
▸ ALDH1A1 P00352 2/20 0.50
▸ RARB P10826 1/20 0.48
▸ GAA P10253 1/20 0.47
▸ MAPK1 P28482 2/20 0.47
▸ RAB9A P51151 1/20 0.46
▸ MAOB P27338 1/20 0.45
▸ SRD5A2 P31213 1/20 0.44
▸ KDM4E B2RXH2 1/20 0.44
▸ RECQL P46063 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15496870 0.96 RARB (0.55) NPC1MAPTL3MBTL1LMNAALDH1A1
SCHEMBL15496877 0.96 RARB (0.55) NPC1MAPTL3MBTL1LMNAALDH1A1
SCHEMBL17879946 0.89 MAPT (0.57) NPC1MAPTL3MBTL1LMNAALDH1A1
SCHEMBL12455672 0.88 MAPT (0.63) NPC1MAPTL3MBTL1LMNAALDH1A1
SCHEMBL31164293 0.88 MAPT (0.60) MAPTL3MBTL1LMNARARBGAA
SCHEMBL15496907 0.88 MAPT (0.60) MAPTL3MBTL1LMNARARBGAA
SCHEMBL15585749 0.87 KDM4E (0.54) NPC1L3MBTL1LMNAALDH1A1KDM4E
SCHEMBL21897674 0.87 KDM4E (0.54) NPC1L3MBTL1LMNAALDH1A1KDM4E
SCHEMBL12835053 0.87 KDM4E (0.54) NPC1L3MBTL1LMNAALDH1A1KDM4E
SCHEMBL20234188 0.87 KDM4E (0.54) NPC1L3MBTL1LMNAALDH1A1KDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9508549-B2 Methods of forming electronic devices including filling porous features with a polymer DOW GLOBAL TECHNOLOGIES LLC (US) 2016-11-29 — — US disclosed
US-9508549-B2 Methods of forming electronic devices including filling porous features with a polymer DOW GLOBAL TECHNOLOGIES LLC (US) 2016-11-29 — — US disclosed
US-20160185984-A1 PORE-FILL COMPOSITIONS DOW GLOBAL TECHNOLOGIES LLC (US) 2016-06-30 — — US disclosed
US-20160185984-A1 PORE-FILL COMPOSITIONS DOW GLOBAL TECHNOLOGIES LLC (US) 2016-06-30 — — US disclosed
US-20160189953-A1 METHODS OF FORMING ELECTRONIC DEVICES ROHM AND HAAS ELECTRONIC MATERIALS LLC 2016-06-30 — — US disclosed
US-20160189953-A1 METHODS OF FORMING ELECTRONIC DEVICES ROHM AND HAAS ELECTRONIC MATERIALS LLC 2016-06-30 — — US disclosed
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