SCHEMBL180149

SCHEMBL180149

CCCCNOCC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Water SCHEMBL28211585 0.97
Hydrochloric Acid SCHEMBL28106515 0.97
SCHEMBL8522322 0.92
SCHEMBL28849523 0.89 EPHX1 (0.48)
SCHEMBL5203363 0.89 EPHX1 (0.48)
SCHEMBL9295907 0.89 EPHX1 (0.48)
SCHEMBL6914040 0.89 EPHX1 (0.48)
SCHEMBL11748589 0.89 EPHX1 (0.48)
SCHEMBL16618599 0.89 EPHX1 (0.48)
SCHEMBL11650879 0.89 EPHX1 (0.48)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 106 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-107357142-B Aqueous photoresist stripping liquid and preparation method thereof 杭州格林达电子材料股份有限公司 2021-01-26 CN claimed
CN-111117223-A Nylon material for automobile bearing and preparation method thereof 南京聚隆科技股份有限公司 2020-05-08 CN claimed
US-4076537-A Light-sensitive materials containing organo tellurium or selenium compounds and sensitizers FUJI PHOTO FILM CO., LTD. (JA) 1978-02-28 US claimed
CN-113574041-B Bisphenol production method and polycarbonate resin production method 三菱化学株式会社 2023-10-13 CN disclosed
CN-113574041-A Method for producing bisphenol and method for producing polycarbonate resin 三菱化学株式会社 2021-10-29 CN disclosed
CN-108699694-B Electroless plating base agent comprising highly branched polymer and metal fine particles 日产化学株式会社 2021-03-12 CN disclosed
US-10920179-B2 Cleaning solution and method for cleaning substrate TOKYO OHKA KOGYO CO., LTD. (JP) 2021-02-16 US disclosed
CN-107357142-B Aqueous photoresist stripping liquid and preparation method thereof 杭州格林达电子材料股份有限公司 2021-01-26 CN disclosed
WO-2020189201-A1 METHOD FOR PRODUCING BISPHENOL AND METHOD FOR PRODUCING POLYCARBONATE RESIN 三菱ケミカル株式会社 2020-09-24 WO disclosed
CN-111117223-A Nylon material for automobile bearing and preparation method thereof 南京聚隆科技股份有限公司 2020-05-08 CN disclosed
CN-110382637-A Printable molecular ink 加拿大国家研究委员会 2019-10-25 CN disclosed
WO-1990001024-A1 NOVEL MAGNETIC RESONANCE IMAGING AGENTS MALLINCKRODT, INC. (US) 1990-02-08 WO disclosed
WO-1988003544-A1 AMIDE MODIFIED EPOXY RESINS THE DOW CHEMICAL COMPANY (US) 1988-05-19 WO disclosed
EP-0266694-A2 Amide modified epoxy resins THE DOW CHEMICAL COMPANY (US) 1988-05-11 EP disclosed
US-4721742-A Amide modified epoxy resins from a dialkanolamine, a monoalkanolamine, an anhydride and (an) unsaturated monomer(s) THE DOW CHEMICAL COMPANY (US) 1988-01-26 US disclosed
US-4609747-A Novel water-soluble antimony compounds and their preparation ATLANTIC RICHFIELD (US) 1986-09-02 US disclosed
EP-0103895-A2 Novel hydroxylamine derivatives, production and use thereof MEIJI SEIKA KABUSHIKI KAISHA (JP) 1984-03-28 EP disclosed
US-4076537-A Light-sensitive materials containing organo tellurium or selenium compounds and sensitizers FUJI PHOTO FILM CO., LTD. (JA) 1978-02-28 US disclosed
US-4076530-A Dry photographic copying method for producing Te images FUJI PHOTO FILM CO., LTD. (JA) 1978-02-28 US disclosed
US-4062685-A ORGANO-TELLURIUM COMPOUND FUJI PHOTO FILM CO., LTD. (JA) 1977-12-13 US disclosed