⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL5925133 | 0.83 | — | — | |
| SCHEMBL1971106 | 0.75 | — | — | |
| SCHEMBL2459778 | 0.75 | — | — | |
| SCHEMBL19178199 | 0.67 | — | — | |
| SCHEMBL11239609 | 0.67 | — | — | |
| SCHEMBL266764 | 0.67 | — | — | |
| SCHEMBL9576962 | 0.66 | — | — | |
| SCHEMBL25354322 | 0.63 | — | — | |
| SCHEMBL30959718 | 0.63 | — | — | |
| SCHEMBL9968802 | 0.62 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20230032354-A1 | METHOD FOR FORMING PHOTORESIST PATTERNS | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2023-02-02 | — | — | US | disclosed |
| US-20230021469-A1 | RESIST TOPCOAT COMPOSITION, AND METHOD OF FORMING PATTERNS USING THE COMPOSITION | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2023-01-26 | — | — | US | disclosed |
| US-20230026579-A1 | METHOD FOR FORMING PHOTORESIST PATTERNS | SAMSUNG SDI CO., LTD. (KR) | 2023-01-26 | — | — | US | disclosed |
| US-20230028244-A1 | RESIST TOPCOAT COMPOSITION, AND METHOD OF FORMING PATTERNS USING THE COMPOSITION | SAMSUNG SDI CO., LTD. (KR) | 2023-01-26 | — | — | US | disclosed |
| US-20230026721-A1 | RESIST TOPCOAT COMPOSITION, AND METHOD OF FORMING PATTERNS USING THE COMPOSITION | SAMSUNG SDI CO., LTD. (KR) | 2023-01-26 | — | — | US | disclosed |
| US-20230024422-A1 | RESIST TOPCOAT COMPOSITION, AND METHOD OF FORMING PATTERNS USING THE COMPOSITION | SAMSUNG SDI CO., LTD. (KR) | 2023-01-26 | — | — | US | disclosed |
| US-20110123933-A1 | POLYMER, COMPOSITION FOR PROTECTIVE LAYER, AND PATTERNING METHOD USING THE SAME | CHEIL INDUSTRIES, INC. (KR) | 2011-05-26 | — | — | US | disclosed |