⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL10347280 | 1.00 | — | — | |
| SCHEMBL28151476 | 1.00 | — | — | |
| SCHEMBL139039 | 1.00 | — | — | |
| SCHEMBL29387719 | 1.00 | — | — | |
| SCHEMBL23722424 | 0.82 | — | — | |
| SCHEMBL11302056 | 0.82 | — | — | |
| SCHEMBL11789868 | 0.82 | — | — | |
| SCHEMBL526809 | 0.82 | — | — | |
| SCHEMBL739615 | 0.82 | — | — | |
| Phosphine SCHEMBL306048 | 0.82 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20250368501-A1 | BARRIER STRUCTURE WITHIN A MICROELECTRONIC ENCLOSURE | TEXAS INSTRUMENTS INC (US) | 2025-12-04 | — | — | US | disclosed |
| US-12421104-B2 | Barrier structure within a microelectronic enclosure | TEXAS INSTRUMENTS INCORPORATED (US) | 2025-09-23 | — | — | US | disclosed |
| CN-115976586-B | Forward and reverse pulse electrolytic nickel-tungsten alloy solution, preparation method, electroplating method and nickel-tungsten alloy coating | 昆山一鼎工业科技有限公司 | 2025-03-14 | — | — | CN | disclosed |
| CN-114843390-A | Display device | 友达光电股份有限公司 | 2022-08-02 | — | — | CN | disclosed |
| US-20220212919-A1 | BARRIER STRUCTURE WITHIN A MICROELECTRONIC ENCLOSURE | TEXAS INSTRUMENTS INCORPORATED | 2022-07-07 | — | — | US | disclosed |
| US-10147710-B2 | Method of embedding WLCSP components in E-WLB and E-PLB | INTEL CORPORATION (US) | 2018-12-04 | — | — | US | disclosed |
| US-20180269190-A1 | METHOD OF EMBEDDING WLCSP COMPONENTS IN E-WLB AND E-PLB | INTEL CORP (US) | 2018-09-20 | — | — | US | disclosed |
| US-9991239-B2 | Method of embedding WLCSP components in e-WLB and e-PLB | INTEL CORPORATION (US) | 2018-06-05 | — | — | US | disclosed |
| EP-3195356-A1 | METHOD OF EMBEDDING WLCSP COMPONENTS IN E-WLB AND E-PLB | Intel Corporation (US) | 2017-07-26 | — | — | EP | disclosed |
| CN-105992625-A | Method of embedding WLCSP components in E-WLB and E-PLB | 英特尔公司 | 2016-10-05 | — | — | CN | disclosed |
| US-20160276325-A1 | METHOD OF EMBEDDING WLCSP COMPONENTS IN E-WLB AND E-PLB | INTEL CORPORATION (US) | 2016-09-22 | — | — | US | disclosed |