SCHEMBL180827

SCHEMBL180827

[Cr].[Cr].[Cu]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL25507 1.00
SCHEMBL29842640 1.00
SCHEMBL7529725 1.00
SCHEMBL3748135 1.00
SCHEMBL25329105 0.82
Fluoride SCHEMBL1357475 0.82
SCHEMBL5158183 0.82
SCHEMBL1449662 0.82
SCHEMBL11340741 0.82
SCHEMBL10583268 0.82

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 64 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116456614-A Preparation method of chromium copper chromium circuit substrate 江西荣晖电子有限公司 2023-07-18 CN claimed
CN-102881511-A Contact with function of controlling directional extension movement of vacuum arc UNIV XI AN JIAOTONG 2013-01-16 CN claimed
JP-3136243-A None JP disclosed
CN-119952078-A Copper-chromium alloy contact part and preparation method thereof 陕西斯瑞铜合金创新中心有限公司 2025-05-09 CN disclosed
CN-114951665-B Preparation method of low-cost high-density high-conductivity copper-chromium contact 浙江省冶金研究院有限公司 2024-04-16 CN disclosed
CN-116456614-A Preparation method of chromium copper chromium circuit substrate 江西荣晖电子有限公司 2023-07-18 CN disclosed
CN-116456614-A Preparation method of chromium copper chromium circuit substrate 江西荣晖电子有限公司 2023-07-18 CN disclosed
CN-116456614-A Preparation method of chromium copper chromium circuit substrate 江西荣晖电子有限公司 2023-07-18 CN disclosed
CN-218526299-U Surface acoustic wave filter with excellent in-band performance 全讯射频科技(无锡)有限公司 2023-02-24 CN disclosed
CN-111069615-B Spherical high-chromium copper alloy powder for 3D printing and preparation method thereof 中航迈特粉冶科技(徐州)有限公司 2022-11-18 CN disclosed
CN-115274610-A Multi-chip semiconductor package 台湾积体电路制造股份有限公司 2022-11-01 CN disclosed
EP-1130620-A2 AC plasma display device and method for production thereof SONY CORPORATION (JP) 2001-09-05 EP disclosed
US-5909069-A Fully integrated magnetic micromotors and methods for their fabrication GEORGIA TECH RESEARCH CORPORATION (US) 1999-06-01 US disclosed
EP-0895447-A2 A circuit board, a method for manufacturing same, and a method of electroless plating Hitachi, Ltd. (JP) 1999-02-03 EP disclosed
JP-H03136243-A FORMATION OF INTEGRATED CIRCUIT STRUCTURE HEWLETT PACKARD CO <HP> 1991-06-11 JP disclosed
EP-0149105-B1 SOLAR INSULATING WINDOW FILM OPTICAL COATING LABORATORY, INC. (US) 1989-07-12 EP disclosed
US-4810332-A PROTECTIVE COATING; HIGH DENSITY INTEGRATED CIRCUITS MICROELECTRONICS AND COMPUTER TECHNOLOGY CORPORATION (US) 1989-03-07 US disclosed
US-4581282-A MULTILAYER-PLASTICS, COPPER, METAL, OXIDE, OR SULFIDE OR NICKEL, PALLADIUM OR CHROMIUM OPTICAL COATING LABORATORY, INC. (US) 1986-04-08 US disclosed
EP-0149105-A2 Solar insulating window film OPTICAL COATING LABORATORY, INC. (US) 1985-07-24 EP disclosed
US-3962597-A Gas discharge display panel including electrode connections in plurality of non-conductive layers INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 1976-06-08 US disclosed