SCHEMBL18175852

SCHEMBL18175852

C=CCCCCC(CO)(CO)CO

nearest known ligand 0.39

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.39
ABCC4 O15439 1/20 0.38
MAPT P10636 1/20 0.38
ALDH1A1 P00352 4/20 0.36
LPAR3 Q9UBY5 2/20 0.33
LMNA P02545 1/20 0.33
LPAR2 Q9HBW0 1/20 0.33
USP2 O75604 1/20 0.33
TRPA1 O75762 2/20 0.32
TP53 P04637 1/20 0.31
CYP3A4 P08684 1/20 0.31
MAPK1 P28482 1/20 0.31
SMN1; SMN2 Q16637 1/20 0.31
HIF1A Q16665 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31153229 0.98 TSHR (0.42) TSHRABCC4MAPTALDH1A1LPAR3
SCHEMBL31153236 0.98 TSHR (0.42) TSHRABCC4MAPTALDH1A1LPAR3
SCHEMBL6900617 0.98 TSHR (0.42) TSHRABCC4MAPTALDH1A1LPAR3
SCHEMBL9245891 0.98 TSHR (0.42) TSHRABCC4MAPTALDH1A1LPAR3
SCHEMBL31153231 0.98 TSHR (0.42) TSHRABCC4MAPTALDH1A1LPAR3
SCHEMBL30517295 0.98 TSHR (0.42) TSHRABCC4MAPTALDH1A1LPAR3
SCHEMBL31153230 0.98 TSHR (0.42) TSHRABCC4MAPTALDH1A1LPAR3
SCHEMBL30517291 0.92 MAPT (0.39) TSHRABCC4MAPTALDH1A1LPAR3
SCHEMBL25410498 0.87 MAPT (0.39) TSHRABCC4MAPTALDH1A1LPAR3
SCHEMBL15244053 0.87 TSHR (0.43) TSHRABCC4MAPTALDH1A1LPAR3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-122071569-A Curable resin composition and cured product 爱天思株式会社 2026-05-22 CN disclosed
WO-2024237134-A1 CURABLE COMPOSITION, METHOD FOR PRODUCING PIXEL, FILM, OPTICAL FILTER, SOLID-STATE IMAGING ELEMENT, AND IMAGE DISPLAY DEVICE 富士フイルム株式会社 2024-11-21 WO disclosed
CN-116507691-A Solvent-free reactive adhesive, cured product thereof, and laminate 东洋油墨SC控股株式会社 2023-07-28 CN disclosed
WO-2022071514-A1 ADHESIVE, CURED PRODUCT, AND LAMINATE 東洋インキSCホールディングス株式会社 2022-04-07 WO disclosed
EP-3085727-B1 SILICONE AND USE THEREOF SHINETSU CHEMICAL CO (JP) 2017-06-21 EP disclosed
US-9567441-B2 Silicone and use thereof SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-02-14 US disclosed
US-9567441-B2 Silicone and use thereof SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-02-14 US disclosed
US-20160311981-A1 SILICONE AND USE THEREOF SHIN-ETSU CHEMICAL CO., LTD. (JP) 2016-10-27 US disclosed
US-20160311981-A1 SILICONE AND USE THEREOF SHIN-ETSU CHEMICAL CO., LTD. (JP) 2016-10-27 US disclosed
EP-3085727-A1 SILICONE AND USE THEREOF Shin-Etsu Chemical Co., Ltd. (JP) 2016-10-26 EP disclosed