Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | PDE3B | Q13370 | 2/20 | 0.33 |
| ▸ | PDE3A | Q14432 | 2/20 | 0.33 |
| ▸ | MAPK14 | Q16539 | 1/20 | 0.33 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.33 |
| ▸ | PLA2G10 | O15496 | 1/20 | 0.33 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.33 |
| ▸ | GAA | P10253 | 1/20 | 0.33 |
| ▸ | HPGD | P15428 | 1/20 | 0.33 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.33 |
| ▸ | CA1 | P00915 | 1/20 | 0.33 |
| ▸ | GDA | Q9Y2T3 | 2/20 | 0.32 |
| ▸ | XDH | P47989 | 1/20 | 0.32 |
| ▸ | ACHE | P22303 | 1/20 | 0.32 |
| ▸ | DPYD | Q12882 | 1/20 | 0.32 |
| ▸ | APAF1 | O14727 | 1/20 | 0.32 |
| ▸ | POLB | P06746 | 1/20 | 0.32 |
| ▸ | RAB9A | P51151 | 1/20 | 0.32 |
| ▸ | PAX8 | Q06710 | 1/20 | 0.32 |
| ▸ | IDH1 | O75874 | 1/20 | 0.32 |
| ▸ | CSNK2A2 | P19784 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3798661 | 1.00 | PDE3B (0.33) | PDE3BPDE3AMAPK14KDM4EPLA2G10 | |
| SCHEMBL30107638 | 0.76 | — | — | |
| SCHEMBL9062085 | 0.76 | IDH1 (0.44) | PDE3BPDE3AKDM4EPLA2G10ALDH1A1 | |
| Cyanide SCHEMBL21647143 | 0.72 | IDH1 (0.37) | PDE3BPDE3AKDM4EPLA2G10ALDH1A1 | |
| Hydrochloric Acid SCHEMBL237155 | 0.71 | IDH1 (0.41) | PDE3BPDE3AKDM4EPLA2G10ALDH1A1 | |
| SCHEMBL7169438 | 0.71 | IDH1 (0.41) | PDE3BPDE3AKDM4EPLA2G10ALDH1A1 | |
| SCHEMBL11174049 | 0.71 | IDH1 (0.41) | PDE3BPDE3AKDM4EPLA2G10ALDH1A1 | |
| SCHEMBL15992544 | 0.71 | IDH1 (0.41) | PDE3BPDE3AKDM4EPLA2G10ALDH1A1 | |
| SCHEMBL1306657 | 0.71 | IDH1 (0.41) | PDE3BPDE3AKDM4EPLA2G10ALDH1A1 | |
| SCHEMBL21647160 | 0.71 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 75 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| JP-61271320-A | — | — | None | — | — | JP | disclosed |
| CN-110753881-B | Alkali-developable photosensitive resin composition, dry film, cured product, and printed wiring board | 太阳控股株式会社 | 2024-06-21 | — | — | CN | disclosed |
| CN-113646698-B | Photoresist composition and cured product thereof | 太阳控股株式会社 | 2024-05-10 | — | — | CN | disclosed |
| CN-117999516-A | Photosensitive resin composition, dry film, cured product, and printed wiring board | 太阳控股株式会社 | 2024-05-07 | — | — | CN | disclosed |
| CN-117908328-A | Photosensitive resin composition, dry film, cured product, and printed wiring board | 太阳控股株式会社 | 2024-04-19 | — | — | CN | disclosed |
| CN-117850164-A | Curable resin composition, dry film, cured product, and printed wiring board | 太阳控股株式会社 | 2024-04-09 | — | — | CN | disclosed |
| CN-117413372-A | LED mounting substrate and LED mounting substrate | 太阳控股株式会社 | 2024-01-16 | — | — | CN | disclosed |
| CN-109143779-B | Photosensitive film laminate and cured product thereof | 太阳控股株式会社 | 2024-01-05 | — | — | CN | disclosed |
| CN-108227378-B | Heat-curable solder resist composition, dry film thereof, cured product thereof, and printed wiring board | 太阳油墨（苏州）有限公司 | 2023-12-15 | — | — | CN | disclosed |
| CN-117099486-A | Laminated curable resin structure, dry film, cured product, and electronic component | 太阳油墨制造株式会社 | 2023-11-21 | — | — | CN | disclosed |
| WO-2006071640-A2 | PHOTOLYTIC POLYMER SURFACE MODIFICATION | THE REGENTS OF THE UNIVERSITY OF COLORADO (US) | 2006-07-06 | — | — | WO | disclosed |
| CN-1779568-A | Hardenable resin composition, hardened body thereof, and printed wiring board | TAIYO INK MFG CO LTD (JP) | 2006-05-31 | — | — | CN | disclosed |
| US-20050263909-A1 | Semiconductor device | SHENZHEN TOREY MICROELECTRONIC TECHNOLOGY CO. LTD. (CN) | 2005-12-01 | — | — | US | disclosed |
| CN-1697858-A | Photo-curable and thermosetting resin composition | TAIYO INK MFG CO LTD (JP) | 2005-11-16 | — | — | CN | disclosed |
| US-20050116387-A1 | Component packaging apparatus, systems, and methods | DAVISON PETER A (US) | 2005-06-02 | — | — | US | disclosed |
| US-20050116299-A1 | Component packaging apparatus, systems, and methods | INTEL CORPORATION | 2005-06-02 | — | — | US | disclosed |
| CN-1472253-A | Optical solidifying-thermo solidifying resin composition and its solidified products | 太阳油墨制造株式会社 | 2004-02-04 | — | — | CN | disclosed |
| EP-0166588-B1 | EPOXY RESIN COMPOSITION | SHIKOKU CHEMICALS CORPORATION (JP) | 1988-09-14 | — | — | EP | disclosed |
| EP-0279407-A2 | Electroconductive polymer film and method for producing the same | MITSUI MINING COMPANY, LIMITED (JP) | 1988-08-24 | — | — | EP | disclosed |
| JP-S61271320-A | EPOXY RESIN COMPOSITION FOR SEALING IC | MATSUSHITA ELECTRIC WORKS LTD | 1986-12-01 | — | — | JP | disclosed |