Predicted protein targets (top 15)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | PTGS1 | P23219 | 7/20 | 0.65 |
| ▸ | PTGS2 | P35354 | 7/20 | 0.65 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.61 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.61 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.61 |
| ▸ | GABBR2 | O75899 | 2/20 | 0.56 |
| ▸ | GABBR1 | Q9UBS5 | 2/20 | 0.56 |
| ▸ | ALOX5 | P09917 | 4/20 | 0.53 |
| ▸ | TTR | P02766 | 1/20 | 0.52 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.50 |
| ▸ | CA2 | P00918 | 1/20 | 0.50 |
| ▸ | POLB | P06746 | 1/20 | 0.50 |
| ▸ | TYR | P14679 | 1/20 | 0.50 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.50 |
| ▸ | HTT | P42858 | 1/20 | 0.50 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1823687 | 1.00 | PTGS1 (0.65) | PTGS1PTGS2CYP1A2CYP2C9CYP2C19 | |
| SCHEMBL1825661 | 0.98 | PTGS1 (0.62) | PTGS1PTGS2CYP1A2CYP2C9CYP2C19 | |
| SCHEMBL1825659 | 0.98 | PTGS1 (0.62) | PTGS1PTGS2CYP1A2CYP2C9CYP2C19 | |
| SCHEMBL1821490 | 0.88 | PTGS1 (0.61) | PTGS1PTGS2CYP1A2CYP2C9CYP2C19 | |
| SCHEMBL1821488 | 0.88 | PTGS1 (0.61) | PTGS1PTGS2CYP1A2CYP2C9CYP2C19 | |
| SCHEMBL1821480 | 0.87 | PTGS1 (0.74) | PTGS1PTGS2CYP1A2CYP2C9CYP2C19 | |
| SCHEMBL1821479 | 0.87 | PTGS1 (0.74) | PTGS1PTGS2CYP1A2CYP2C9CYP2C19 | |
| SCHEMBL8091847 | 0.86 | CYP2C9 (0.59) | PTGS1PTGS2CYP1A2CYP2C9CYP2C19 | |
| SCHEMBL11302044 | 0.84 | SMN1; SMN2 (0.49) | PTGS1PTGS2CYP1A2CYP2C9CYP2C19 | |
| SCHEMBL11302041 | 0.84 | SMN1; SMN2 (0.49) | PTGS1PTGS2CYP1A2CYP2C9CYP2C19 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 40 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20110163461-A1 | ELECTRONIC PACKAGING | EVONIK DEGUSSA GMBH (DE) | 2011-07-07 | — | — | US | claimed |
| US-8008410-B2 | Epoxy resin composition for encapsulating semiconductor and semiconductor device | SUMITOMO BAKELITE COMPANY, LTD. (JP) | 2011-08-30 | — | — | US | disclosed |
| US-20110163461-A1 | ELECTRONIC PACKAGING | EVONIK DEGUSSA GMBH (DE) | 2011-07-07 | — | — | US | disclosed |
| EP-2119737-B1 | Electronic packaging | EVONIK DEGUSSA GMBH (DE) | 2011-05-04 | — | — | EP | disclosed |
| US-7846998-B2 | nonhalogenated and non-antimony sealant epoxy-resin molding material superior in flame resistance and still retaining reliability, for example, of moldability, reflow resistance, moisture resistance and high-temperature storage | HITACHI CHEMICAL CO., LTD. (JP) | 2010-12-07 | — | — | US | disclosed |
| EP-2119737-A1 | Electronic packaging | Evonik Degussa GmbH (DE) | 2009-11-18 | — | — | EP | disclosed |
| US-20090143511-A1 | ENCAPSULATED EPOXY-RESIN MOLDING COMPOUND, AND ELECTRONIC COMPONENT DEVICE | HITACHI CHEMICAL CO., LTD. (JP) | 2009-06-04 | — | — | US | disclosed |
| US-20090137717-A1 | ENCAPSULATED EPOXY RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE | HITACHI CHEMICAL CO., LTD. (JP) | 2009-05-28 | — | — | US | disclosed |
| US-20090062430-A1 | Epoxy Resin Composition for Sealing and Electronic Component Device | HITACHI CHEMICAL CO., LTD. (JP) | 2009-03-05 | — | — | US | disclosed |
| US-20080234409-A1 | nonhalogenated and non-antimony sealant epoxy-resin molding material superior in flame resistance and still retaining reliability, for example, of moldability, reflow resistance, moisture resistance and high-temperature storage | HITACHI CHEMICAL CO., LTD. (JP) | 2008-09-25 | — | — | US | disclosed |
| EP-0943639-A2 | Epoxy resin composition and resin-encapsulated semiconductor device | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1999-09-22 | — | — | EP | disclosed |
| US-5939509-A | Epoxy resin, resin composition, and resin-encapsulated semiconductor device | SUMITOMO CHEMICAL COMPANY, LTD. (JP) | 1999-08-17 | — | — | US | disclosed |
| US-5939473-A | Epoxy resin, resin composition, and resin-encapsulated semiconductor device | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1999-08-17 | — | — | US | disclosed |
| EP-0739877-B1 | Epoxy resin, resin composition, and resin-encapsulated semiconductor device | SUMITOMO CHEMICAL CO (JP) | 1999-08-04 | — | — | EP | disclosed |
| US-5854370-A | Epoxy resin stilbenes and process for producing the same by photoisomerization | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1998-12-29 | — | — | US | disclosed |
| EP-0869148-A1 | Epoxy resin composition and method for producing the same | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1998-10-07 | — | — | EP | disclosed |
| EP-0869140-A2 | Epoxy resin composition and resin-encapsulated semiconductor device | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1998-10-07 | — | — | EP | disclosed |
| US-5705596-A | STILBENE COMPOUNDS FOR ADHESIVES, PAINTS, ELECTRONICS AND INSULATION OF LAMINATES | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1998-01-06 | — | — | US | disclosed |
| EP-0749968-A1 | Epoxy resin and process for producing the same | SUMITOMO CHEMICAL COMPANY LIMITED (JP) | 1996-12-27 | — | — | EP | disclosed |
| EP-0739877-A2 | Epoxy resin, resin composition, and resin-encapsulated semiconductor device | SUMITOMO CHEMICAL COMPANY LIMITED (JP) | 1996-10-30 | — | — | EP | disclosed |