SCHEMBL1824535

SCHEMBL1824535

Cc1cc(/C=C/c2cc(C)c(O)c(C)c2)ccc1O

nearest known ligand 0.68

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
PTGS1 P23219 15/20 0.68
PTGS2 P35354 15/20 0.68
ALOX5 P09917 12/20 0.68
TTR P02766 2/20 0.62
LCK P06239 1/20 0.52
CYP1A2 P05177 1/20 0.52
CYP3A4 P08684 1/20 0.52
CYP2D6 P10635 1/20 0.52
CYP2C9 P11712 1/20 0.52
CYP2B6 P20813 1/20 0.52

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1824536 1.00 PTGS1 (0.68) PTGS1PTGS2ALOX5TTRLCK
SCHEMBL1824386 0.91 LCK (0.61) PTGS1PTGS2ALOX5TTRLCK
SCHEMBL1824384 0.91 LCK (0.61) PTGS1PTGS2ALOX5TTRLCK
SCHEMBL10054225 0.90 LCK (0.56) PTGS1PTGS2ALOX5TTRLCK
SCHEMBL24222559 0.86 TUBB1 (0.57) PTGS1PTGS2ALOX5TTRLCK
SCHEMBL17356222 0.86 KDM4E (0.68) PTGS1PTGS2ALOX5TTRLCK
SCHEMBL1821490 0.84 PTGS1 (0.61) PTGS1PTGS2ALOX5TTRCYP1A2
SCHEMBL1821488 0.84 PTGS1 (0.61) PTGS1PTGS2ALOX5TTRCYP1A2
SCHEMBL1824102 0.84 PTGS1 (0.74) PTGS1PTGS2ALOX5TTRCYP1A2
SCHEMBL1824103 0.84 PTGS1 (0.74) PTGS1PTGS2ALOX5TTRCYP1A2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20110163461-A1 ELECTRONIC PACKAGING EVONIK DEGUSSA GMBH (DE) 2011-07-07 US claimed
US-20110163461-A1 ELECTRONIC PACKAGING EVONIK DEGUSSA GMBH (DE) 2011-07-07 US disclosed
EP-2119737-B1 Electronic packaging EVONIK DEGUSSA GMBH (DE) 2011-05-04 EP disclosed
EP-2119737-A1 Electronic packaging Evonik Degussa GmbH (DE) 2009-11-18 EP disclosed
EP-0869140-B1 Epoxy resin composition and resin-encapsulated semiconductor device SUMITOMO CHEMICAL CO (JP) 2003-08-13 EP disclosed
US-6255409-B1 EPOXY RESIN COMPOSITION COMPRISING BIFUNCTIONAL CRYSTALLINE EPOXY COMPOUND, AMORPHOUS TRISPHENOLMETHANE TYPE EPOXY COMPOUND HAVING THREE OR MORE EPOXY GROUPS IN MOLECULE, AND EPOXY CURING AGENT HAVING PHENOLIC HYDROXYL GROUPS SUMITOMO CHEMICAL CO., LTD. (JP) 2001-07-03 US disclosed
US-6190786-B1 BIS(GLYCIDYLOXY)STILBENE RESINS SUMITOMO CHEMICAL COMPANY, LTD. (JP) 2001-02-20 US disclosed
EP-0943639-A2 Epoxy resin composition and resin-encapsulated semiconductor device SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1999-09-22 EP disclosed
EP-0869140-A2 Epoxy resin composition and resin-encapsulated semiconductor device SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1998-10-07 EP disclosed