SCHEMBL1832260

SCHEMBL1832260

CCC[N+](C(C)C)(C(C)C)C(C)C

nearest known ligand 0.41

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
SLC22A1 O15245 3/20 0.41
TSHR P16473 2/20 0.33
SLC22A2 O15244 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5284844 0.80 SLC22A1 (0.47) SLC22A1TSHRSLC22A2
SCHEMBL5298131 0.78 SLC22A1 (0.53) SLC22A1TSHRSLC22A2
SCHEMBL5289880 0.76 SLC22A1 (0.55) SLC22A1TSHRSLC22A2
SCHEMBL5288511 0.76 SLC22A1 (0.55) SLC22A1TSHRSLC22A2
SCHEMBL5295844 0.76 SLC22A1 (0.55) SLC22A1TSHRSLC22A2
SCHEMBL5289382 0.76 SLC22A1 (0.55) SLC22A1TSHRSLC22A2
SCHEMBL5303393 0.76 SLC22A1 (0.55) SLC22A1TSHRSLC22A2
SCHEMBL5289310 0.76 SLC22A1 (0.55) SLC22A1TSHRSLC22A2
SCHEMBL5299027 0.76 SLC22A1 (0.55) SLC22A1TSHRSLC22A2
SCHEMBL5308395 0.76 SLC22A1 (0.55) SLC22A1TSHRSLC22A2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 59 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3042939-B1 ADHESIVE COMPOSITION TOAGOSEI CO LTD (JP) 2021-06-23 EP disclosed
EP-3042933-B1 CURABLE RESIN COMPOSITION TOAGOSEI CO LTD (JP) 2020-09-30 EP disclosed
WO-2020071553-A1 ADHESIVE COMPOSITION FOR ASSEMBLING SPEAKER, METHOD FOR ASSEMBLING SPEAKER, AND SPEAKER 東亞合成株式会社 2020-04-09 WO disclosed
EP-2896668-B1 2-CYANOACRYLATE-BASED ADHESIVE COMPOSITION TOAGOSEI CO LTD (JP) 2019-11-13 EP disclosed
CN-107108771-B Two-liquid type solidification compound 东亚合成株式会社 2019-08-16 CN disclosed
EP-3231818-B1 TWO-PART CURABLE COMPOSITION TOAGOSEI CO LTD (JP) 2019-08-14 EP disclosed
CN-105579537-B Adhesive composite 东亚合成株式会社 2018-11-27 CN disclosed
CN-105593307-B Hardening resin composition 东亚合成株式会社 2018-07-27 CN disclosed
US-9994662-B2 Two-part curable composition TOAGOSEI CO., LTD. (JP) 2018-06-12 US disclosed
EP-2933302-B1 ADHESIVE COMPOSITION TOAGOSEI CO LTD (JP) 2018-04-04 EP disclosed
WO-2007006418-A1 IONIC-LIQUID-CONTAINING PRODUCTS FOR DYEING AND/OR BRIGHTENING KERATIN FIBRES HENKEL KOMMANDITGESELLSCHAFT AUF AKTIEN (DE) 2007-01-18 WO disclosed
US-20070002522-A1 Electric double layer capacitor and electrolytic solution therefor MITSUBISHI CHEMICAL CORPORATION (JP) 2007-01-04 US disclosed
WO-2006131234-A1 COSMETIC COMPOSITIONS COMPRISING IONIC LIQUIDS HENKEL KOMMANDITGESELLSCHAFT AUF AKTIEN (DE) 2006-12-14 WO disclosed
US-20060262485-A1 Electric double layer capacitor and electrolytic solution therefor MITSUBISHI CHEMICAL CORPORATION (JP) 2006-11-23 US disclosed
US-7072173-B2 Electrolyte for electrolytic capacitor and electrolytic capacitor using the same MITSUBISHI CHEMICAL CORPORATION (JP) 2006-07-04 US disclosed
US-20060092597-A1 Electrolyte for electrolytic capacitor and electrolytic capacitor using the same MITSUBISHI CHEMICAL CORPORATION (JP) 2006-05-04 US disclosed
US-20060007629-A1 Electrolyte for electrolytic capacitor, electrolytic capacitor and process for producing tetrafluoroaluminate salt of organic onium MITSUBISHI CHEMICAL CORPORATION (JP) 2006-01-12 US disclosed
EP-1564768-A1 ELECTROLYTE FOR ELECTROLYTIC CAPACITOR, ELECTROLYTIC CAPACITOR AND PROCESS FOR PRODUCING TETRAFLUOROALUMINATE SALT OF ORGANIC ONIUM Mitsubishi Chemical Corporation (JP) 2005-08-17 EP disclosed
US-20040095708-A1 Electrolyte for electolytic capacitor and electrolytic capacitor using the same MITSUBISHI CHEMICAL CORPORATION (JP) 2004-05-20 US disclosed
EP-1394824-A1 ELECTROLYTIC SOLUTION FOR ELECTROLYTIC CAPACITOR AND ELECTROLYTIC CAPACITOR USING IT Mitsubishi Chemical Corporation (JP) 2004-03-03 EP disclosed