SCHEMBL1834503

SCHEMBL1834503

CCCCCCCCCCCCCCCCCCc1ccc(C(=O)Nc2ccc(O)cc2)cc1

nearest known ligand 0.68

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TRPV1 Q8NER1 5/20 0.68
KDM4E B2RXH2 3/20 0.64
ESR1 P03372 2/20 0.63
ADRA2A P08913 2/20 0.63
ADORA3 P0DMS8 2/20 0.63
TACR2 P21452 2/20 0.63
SLC6A2 P23975 2/20 0.63
SLC6A4 P31645 2/20 0.63
SLC6A3 Q01959 2/20 0.63
ALDH1A1 P00352 1/20 0.63
LMNA P02545 1/20 0.63
SHBG P04278 1/20 0.63
TP53 P04637 1/20 0.63
CYP3A4 P08684 1/20 0.63
HSPD1 P10809 1/20 0.63
ADRB3 P13945 1/20 0.63
HTR2C P28335 1/20 0.63
HSPE1 P61604 1/20 0.63
HIF1A Q16665 1/20 0.63
TST Q16762 1/20 0.63

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15923653 1.00 TRPV1 (0.68) TRPV1KDM4EESR1ADRA2AADORA3
SCHEMBL8388379 1.00 TRPV1 (0.68) TRPV1KDM4EESR1ADRA2AADORA3
SCHEMBL8756973 1.00 TRPV1 (0.68) TRPV1KDM4EESR1ADRA2AADORA3
SCHEMBL8391488 1.00 TRPV1 (0.68) TRPV1KDM4EESR1ADRA2AADORA3
SCHEMBL8756857 1.00 TRPV1 (0.68) TRPV1KDM4EESR1ADRA2AADORA3
SCHEMBL8755809 1.00 TRPV1 (0.68) TRPV1KDM4EESR1ADRA2AADORA3
SCHEMBL4751447 0.99 TRPV1 (0.69) TRPV1KDM4EESR1ADRA2AADORA3
SCHEMBL12440862 0.90 TRPV1 (0.69) TRPV1KDM4EPLK1PLK3NPC1
SCHEMBL2831713 0.89 TRPV1 (0.68) TRPV1KDM4EPLK1PLK3NPC1
SCHEMBL15922369 0.89 TRPV1 (0.68) TRPV1KDM4EPLK1PLK3NPC1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 29 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7381684-B2 Method for using a rewritable thermal label LINTEC CORPORATION (JP) 2008-06-03 US claimed
US-6956010-B2 Rewritable thermal label of a non-contact type and method for using the label LINTEC CORPORATION (JP) 2005-10-18 US claimed
US-20050170960-A1 Method for using a rewritable thermal label LINTEC CORPORATION (JP) 2005-08-04 US claimed
EP-1923227-B1 A structure with a built-in recording medium, a laminate comprising the structure and method for recording in non-contact manner using the structure and the laminate LINTEC CORP (JP) 2011-05-11 EP disclosed
US-7939464-B2 Resin laminate material with a built-in recording medium with a means for rewriting visible information with a laser light in a non-contact manner; recording and erasing of information can be conducted by irradiation with a laser light from outside LINTEC CORPORATION (JP) 2011-05-10 US disclosed
EP-1583089-B1 OPTICAL INFORMATION RECORDING MEDIUM MITSUBISHI KAGAKU MEDIA CO LTD (JP) 2009-07-15 EP disclosed
US-7551541-B2 Optical information recording medium MITSUBISHI KAGAKU MEDIA CO., LTD. (JP) 2009-06-23 US disclosed
US-7512059-B2 Optical information recording medium and process for producing optical information recording medium MITSUBISHI KAGAKU MEDIA CO., LTD. (JP) 2009-03-31 US disclosed
US-7381684-B2 Method for using a rewritable thermal label LINTEC CORPORATION (JP) 2008-06-03 US disclosed
US-20080119359-A1 Structure with a built-in recording medium, a laminate comprising the structure and method for recording in non-contact manner using the structure and the laminate LINTEC CORPORATION (JP) 2008-05-22 US disclosed
EP-1923227-A2 A structure with a built-in recording medium, a laminate comprising the structure and method for recording in non-contact manner using the structure and the laminate Lintec Corporation (JP) 2008-05-21 EP disclosed
US-20050170960-A1 Method for using a rewritable thermal label LINTEC CORPORATION (JP) 2005-08-04 US disclosed
EP-1431058-A2 Method for recording and erasure of images using a rewritable thermal label of a non-contact type Lintec Corporation (JP) 2004-06-23 EP disclosed
US-20040116289-A1 Method for recording and erasure of images using a rewritable thermal label of a non-contact type LINTEC CORPORATION (JP) 2004-06-17 US disclosed
EP-1304674-A2 Rewritable thermal label of a non-contact type and method for using the label Lintec Corporation (JP) 2003-04-23 EP disclosed
US-20030070339-A1 Rewritable thermal label of a non-contact type and method for using the label LINTEC CORPORATION (JP) 2003-04-17 US disclosed
US-6004899-A SURFACE TREATED WITH SILANE, TITANATE, AND/OR ALUMINUM COUPLING AGENT; PIGMENT; ERASIBILITY MITSUBISHI PAPER MILLS LIMITED (JP) 1999-12-21 US disclosed
EP-0574879-B1 Reversible heat-sensitive recording material MITSUBISHI PAPER MILLS LTD (JP) 1997-05-02 EP disclosed
US-5395815-A Phenolic compound electron acceptor; images; contrast; stability MITSUBISHI PAPER MILLS LIMITED (JP) 1995-03-07 US disclosed
EP-0574879-A1 Reversible heat-sensitive recording material MITSUBISHI PAPER MILLS, LTD. (JP) 1993-12-22 EP disclosed