Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HDAC1 | Q13547 | 3/20 | 0.68 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.65 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.65 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.65 |
| ▸ | MEN1 | O00255 | 2/20 | 0.58 |
| ▸ | MAPT | P10636 | 2/20 | 0.58 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.58 |
| ▸ | KDM4C | Q9H3R0 | 1/20 | 0.55 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.55 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.55 |
| ▸ | KCNMA1 | Q12791 | 3/20 | 0.53 |
| ▸ | PTGS1 | P23219 | 2/20 | 0.52 |
| ▸ | PABPC1 | P11940 | 1/20 | 0.49 |
| ▸ | DUSP3 | P51452 | 1/20 | 0.49 |
| ▸ | PTPN5 | P54829 | 1/20 | 0.49 |
| ▸ | PTPN11 | Q06124 | 1/20 | 0.49 |
| ▸ | EIF4H | Q15056 | 1/20 | 0.49 |
| ▸ | CTDSP1 | Q9GZU7 | 1/20 | 0.49 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.49 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.49 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29513264 | 0.95 | HDAC1 (0.69) | HDAC1SMN1; SMN2NPSR1HSD17B10MEN1 | |
| SCHEMBL16444873 | 0.95 | HDAC1 (0.69) | HDAC1SMN1; SMN2NPSR1HSD17B10MEN1 | |
| SCHEMBL14088959 | 0.89 | HDAC1 (0.74) | HDAC1SMN1; SMN2NPSR1HSD17B10MEN1 | |
| SCHEMBL20584437 | 0.86 | HDAC1 (0.71) | HDAC1SMN1; SMN2NPSR1HSD17B10MEN1 | |
| SCHEMBL18360435 | 0.84 | HDAC1 (0.69) | HDAC1SMN1; SMN2NPSR1HSD17B10MEN1 | |
| SCHEMBL17744840 | 0.84 | SMN1; SMN2 (0.71) | HDAC1SMN1; SMN2NPSR1HSD17B10MEN1 | |
| SCHEMBL2605584 | 0.83 | HDAC1 (0.68) | HDAC1SMN1; SMN2NPSR1HSD17B10MEN1 | |
| SCHEMBL18360219 | 0.83 | MEN1 (0.54) | HDAC1SMN1; SMN2NPSR1HSD17B10MEN1 | |
| SCHEMBL16424442 | 0.81 | HDAC1 (0.64) | HDAC1SMN1; SMN2NPSR1HSD17B10MEN1 | |
| SCHEMBL20445864 | 0.81 | HDAC1 (0.64) | HDAC1SMN1; SMN2NPSR1HSD17B10MEN1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 23 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11860538-B2 | Photosensitive resin composition, heterocyclic ring-containing polymer precursor, cured film, laminate, method for producing cured film, and semiconductor device | FUJIFILM CORPORATION (JP) | 2024-01-02 | — | — | US | disclosed |
| US-11860538-B2 | Photosensitive resin composition, heterocyclic ring-containing polymer precursor, cured film, laminate, method for producing cured film, and semiconductor device | FUJIFILM CORPORATION (JP) | 2024-01-02 | — | — | US | disclosed |
| US-11567405-B2 | Photosensitive resin composition, polymer precursor, cured film, laminate, method for producing cured film, and semiconductor device | FUJIFILM CORPORATION (JP) | 2023-01-31 | — | — | US | disclosed |
| US-20220171285-A1 | METHOD OF MANUFACTURING CURED FILM, PHOTOCURABLE RESIN COMPOSITION, METHOD OF MANUFACTURING LAMINATE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2022-06-02 | — | — | US | disclosed |
| US-20220002488-A1 | CURABLE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR MANUFACTURING CURED FILM, SEMICONDUCTOR DEVICE, AND POLYMER PRECURSOR | FUJIFILM CORPORATION (JP) | 2022-01-06 | — | — | US | disclosed |
| US-20210302835-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, CURED FILM, LAMINATE, AND DEVICE | FUJIFILM CORPORATION (JP) | 2021-09-30 | — | — | US | disclosed |
| US-20210302836-A1 | PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE | FUJIFILM CORPORATION (JP) | 2021-09-30 | — | — | US | disclosed |
| US-10780679-B2 | Laminate, method for manufacturing laminate, semiconductor device, and method for manufacturing the semiconductor device | FUJIFILM CORPORATION (JP) | 2020-09-22 | — | — | US | disclosed |
| US-10450417-B2 | Resin, composition, cured film, method for manufacturing cured film and semiconductor device | FUJIFILM CORPORATION (JP) | 2019-10-22 | — | — | US | disclosed |
| EP-3339023-B1 | LAMINATE, METHOD FOR MANUFACTURING THE LAMINATE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE | FUJIFILM CORP (JP) | 2019-07-03 | — | — | EP | disclosed |
| US-20180215874-A1 | RESIN, COMPOSITION, CURED FILM, METHOD FOR MANUFACTURING CURED FILM AND SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2018-08-02 | — | — | US | disclosed |
| EP-3339023-A1 | LAMINATE, METHOD FOR MANUFACTURING LAMINATE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | FUJI-FILM Corporation (JP) | 2018-06-27 | — | — | EP | disclosed |
| US-20180118887-A1 | PRECURSOR COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PRECURSOR COMPOSITION, CURED FILM, METHOD FOR PRODUCING CURED FILM, AND SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2018-05-03 | — | — | US | disclosed |
| US-20180118887-A1 | PRECURSOR COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PRECURSOR COMPOSITION, CURED FILM, METHOD FOR PRODUCING CURED FILM, AND SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2018-05-03 | — | — | US | disclosed |
| US-20180079864-A1 | POLYIMIDE PRECURSOR COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, METHOD FOR PRODUCING CURED FILM, A SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING POLYIMIDE PRECURSOR COMPOSITION | FUJIFILM CORPORATION (JP) | 2018-03-22 | — | — | US | disclosed |
| US-20180079864-A1 | POLYIMIDE PRECURSOR COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, METHOD FOR PRODUCING CURED FILM, A SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING POLYIMIDE PRECURSOR COMPOSITION | FUJIFILM CORPORATION (JP) | 2018-03-22 | — | — | US | disclosed |
| WO-2017110982-A1 | RESIN, COMPOSITION, CURED FILM, METHOD FOR PRODUCING CURED FILM AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2017-06-29 | — | — | WO | disclosed |
| WO-2017104672-A1 | METHOD FOR PRODUCING HETEROCYCLE-CONTAINING POLYMER PRECURSOR, HETEROCYCLE-CONTAINING POLYMER PRECURSOR, AND USE FOR SAME | 富士フイルム株式会社 | 2017-06-22 | — | — | WO | disclosed |
| WO-2017038664-A1 | COMPOSITION, CURED FILM, METHOD FOR MANUFACTURING CURED FILM, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2017-03-09 | — | — | WO | disclosed |
| WO-2017002859-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, CURED FILM PRODUCTION METHOD AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2017-01-05 | — | — | WO | disclosed |