SCHEMBL1836129

SCHEMBL1836129

C=C(C)c1c(C)ccc(N=C=O)c1C

nearest known ligand 0.48

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
CYP3A4 P08684 3/20 0.48
TRPA1 O75762 1/20 0.43
ALDH1A1 P00352 1/20 0.34
HPGD P15428 1/20 0.34
TDP1 Q9NUW8 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5690528 0.77 CYP3A4 (0.50) CYP3A4TRPA1ALDH1A1HPGDTDP1
SCHEMBL29606267 0.75 CYP3A4 (0.61) CYP3A4TRPA1ALDH1A1HPGDTDP1
SCHEMBL11608345 0.75 CYP3A4 (0.61) CYP3A4TRPA1ALDH1A1HPGDTDP1
SCHEMBL110655 0.74 CYP3A4 (0.73) CYP3A4TRPA1ALDH1A1HPGDTDP1
SCHEMBL31162473 0.74 CYP3A4 (0.73) CYP3A4TRPA1ALDH1A1HPGDTDP1
SCHEMBL28588773 0.74 CYP3A4 (0.55) CYP3A4TRPA1ALDH1A1HPGDTDP1
SCHEMBL3271627 0.73
SCHEMBL9422117 0.72 KDM4E (0.33) TRPA1
SCHEMBL7930419 0.72 CYP3A4 (0.33) CYP3A4TRPA1
SCHEMBL9918934 0.72

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 24 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110485201-A A kind of lignin Cypres and preparation method thereof SHANGHAI CHANGFA NEW MAT CO LTD 2019-11-22 CN claimed
CN-108149516-A A kind of paper or paperboard grade (stock) sizing agent and preparation method thereof 宝艺新材料股份有限公司 2018-06-12 CN claimed
CN-106351066-A A preparing method for surface sizing agent for corrugated paper and its products and application 上海东升新材料有限公司 2017-01-25 CN claimed
CN-104805732-A Styrene-acrylate emulsion type efficient surface sizing agent and preparing method thereof HE MINGBO 2015-07-29 CN claimed
US-5342554-A Vinyl-terminated polyesters and polycarbonates for flexibilizing and improving the toughness of compositions from unsaturated polyesters and fiber reinforced plastics made from them GENCORP INC. (US) 1994-08-30 US claimed
US-6352782-B1 None US disclosed
CN-110485201-A A kind of lignin Cypres and preparation method thereof SHANGHAI CHANGFA NEW MAT CO LTD 2019-11-22 CN disclosed
CN-110485200-A A kind of biomass sizing agent and preparation method thereof SHANGHAI CHANGFA NEW MAT CO LTD 2019-11-22 CN disclosed
CN-108149516-A A kind of paper or paperboard grade (stock) sizing agent and preparation method thereof 宝艺新材料股份有限公司 2018-06-12 CN disclosed
CN-106368061-B A kind of efficient surface sizing agent and preparation method thereof 上海东升新材料有限公司 2018-03-13 CN disclosed
CN-106368061-A High-efficiency surface sizing agent and preparation method thereof 上海东升新材料有限公司 2017-02-01 CN disclosed
CN-106351066-A A preparing method for surface sizing agent for corrugated paper and its products and application 上海东升新材料有限公司 2017-01-25 CN disclosed
EP-1834975-A1 Poly(Phenylene ether) - Polyvinyl thermosetting resin General Electric Company (US) 2007-09-19 EP disclosed
EP-1265946-B1 POLY(PHENYLENE ETHER) - POLYVINYL THERMOSETTING RESIN GEN ELECTRIC (US) 2007-03-28 EP disclosed
US-6617398-B2 Forming laminate; curing; cladding with copper; printed circuits GENERAL ELECTRIC COMPANY 2003-09-09 US disclosed
EP-1265946-A1 POLY(PHENYLENE ETHER) - POLYVINYL THERMOSETTING RESIN GENERAL ELECTRIC COMPANY (US) 2002-12-18 EP disclosed
US-20020028337-A1 Poly (phenylene ether) - polyvinyl thermosetting resin SABIC GLOBAL TECHNOLOGIES B.V. (NL) 2002-03-07 US disclosed
US-6352782-B2 REACTING A POLYPHENYLENE ETHER CONTAINING HYDROXY GROUPS THAT HAVE BEEN CAPPED WITH A COMPOUND CONTAINING ETHYLENICALLY UNSATURATION WITH A CURABLE UNSATURATED MONOMER CAPABLE OF REACTING WITH ETHYLENICALLY UNSATURATED COMPOUND GENERAL ELECTRIC COMPANY 2002-03-05 US disclosed
US-20010053450-A1 POLY (PHENYLENE ETHER) - POLYVINYL THERMOSETTING RESIN SABIC GLOBAL TECHNOLOGIES B.V. (NL) 2001-12-20 US disclosed
WO-2001040354-A1 POLY(PHENYLENE ETHER) - POLYVINYL THERMOSETTING RESIN GENERAL ELECTRIC COMPANY (US) 2001-06-07 WO disclosed