SCHEMBL18435069

SCHEMBL18435069

CC[Si](C#Cc1c2cc3cc(F)sc3cc2c(C#CS(CC)(CC)CC)c2cc3cc(F)sc3cc12)(CC)CC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8224447 0.90 — —
SCHEMBL9933290 0.90 — —
SCHEMBL15827023 0.84 — —
SCHEMBL12240215 0.84 — —
SCHEMBL15827301 0.82 — —
SCHEMBL19531791 0.81 — —
SCHEMBL19531798 0.81 — —
SCHEMBL19721628 0.81 — —
SCHEMBL19214660 0.80 CA12 (0.31) —
SCHEMBL18267816 0.75 — —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3125277-B1 SEMICONDUCTOR ELEMENT COMPRISING INSULATING LAYER-FORMING COMPOSITION FUJIFILM CORP (JP) 2020-06-03 — — EP disclosed
EP-3125277-A1 SEMICONDUCTOR ELEMENT AND INSULATING-LAYER-FORMING COMPOSITION FUJIFILM Corporation (JP) 2017-02-01 — — EP disclosed
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