⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL19179001 | 0.97 | EPHX1 (0.60) | — | |
| SCHEMBL14596585 | 0.97 | — | — | |
| SCHEMBL17849497 | 0.97 | EPHX1 (0.60) | — | |
| SCHEMBL2418284 | 0.97 | EPHX1 (0.60) | — | |
| SCHEMBL11155472 | 0.97 | EPHX1 (0.60) | — | |
| SCHEMBL18784997 | 0.97 | EPHX1 (0.60) | — | |
| SCHEMBL308474 | 0.90 | — | — | |
| SCHEMBL23038635 | 0.87 | EPHX1 (0.50) | — | |
| SCHEMBL88378 | 0.83 | TSHR (0.62) | — | |
| SCHEMBL9273407 | 0.83 | EPHX1 (0.40) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 31 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-101143982-A | Ink composition for inkjet recording | SAMSUNG ELECTRONICS CO LTD (KR) | 2008-03-19 | — | — | CN | claimed |
| WO-2026100487-A1 | UNDERFILL MATERIAL, CURED PRODUCT, SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFACTURING SAME | 旭化成株式会社 | 2026-05-15 | — | — | WO | disclosed |
| WO-2026100491-A1 | EPOXY RESIN COMPOSITION, CURED OBJECT, UNDERFILL MATERIAL, ADHESIVE, AND SEMICONDUCTOR PACKAGE AND PRODUCTION METHOD THEREFOR | 旭化成株式会社 | 2026-05-15 | — | — | WO | disclosed |
| CN-115803323-B | Amine imide compound, amine imide composition, curing agent, epoxy resin composition, process for producing amine imide compound, sealing material, and adhesive | 旭化成株式会社 | 2025-05-16 | — | — | CN | disclosed |
| WO-2025028598-A1 | CURING AGENT FOR EPOXY RESINS, EPOXY RESIN COMPOSITION, CURED OBJECT, SEALING MATERIAL, AND ADHESIVE | 旭化成株式会社 | 2025-02-06 | — | — | WO | disclosed |
| WO-2025028605-A1 | CURING AGENT, EPOXY RESIN COMPOSITION, CURED OBJECT, SEALING MATERIAL, AND ADHESIVE | 旭化成株式会社 | 2025-02-06 | — | — | WO | disclosed |
| WO-2025028611-A1 | CURING AGENT FOR EPOXY RESINS, EPOXY RESIN COMPOSITION, CURED OBJECT, SEALING MATERIAL, AND ADHESIVE | 旭化成株式会社 | 2025-02-06 | — | — | WO | disclosed |
| US-20250034319-A1 | EPOXY RESIN COMPOSITION, CURED PRODUCT, ENCAPSULANT AND ADHESIVE | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2025-01-30 | — | — | US | disclosed |
| CN-118302470-A | Epoxy resin composition, cured product, sealing material, and adhesive | 旭化成株式会社 | 2024-07-05 | — | — | CN | disclosed |
| EP-3714904-B1 | IMINODIACETIC ACID SUBSTITUTED CYCLODEXTRINS AS POTENTIATORS OF BETA-LACTAM ANTIBIOTICS | NATIONAL CENTER FOR SCIENT RESEARCH DEMOKRITOS NCSRD (GR) | 2023-08-23 | — | — | EP | disclosed |
| EP-2361098-B1 | COMPOSITIONS AND METHODS FOR DELIVERING A SUBSTANCE TO A BIOLOGICAL TARGET | MASSACHUSETTS GEN HOSPITAL (US) | 2019-08-28 | — | — | EP | disclosed |
| CN-109836441-A | Carbene compound and Organnic electroluminescent device | 南加州大学 | 2019-06-04 | — | — | CN | disclosed |
| EP-3010054-B1 | OPTOELECTRONIC DEVICE | UNIV OXFORD INNOVATION LTD (GB) | 2019-02-20 | — | — | EP | disclosed |
| WO-2017117393-A1 | METALLOENZYME INHIBITOR COMPOUNDS | VIAMET PHARMACEUTICALS, INC. (US) | 2017-07-06 | — | — | WO | disclosed |
| WO-2017019832-A1 | METHODS AND COMPOSITIONS USING REPAIR CELLS AND CATIONIC DYES | MEDIVATION TECHNOLOGIES, INC. (US) | 2017-02-02 | — | — | WO | disclosed |
| CN-103304356-B | The synthetic method of azanol | BEIJING LAVIANA PHARMATECH CO., LTD. (CN) | 2016-01-20 | — | — | CN | disclosed |
| CN-103304356-A | Hydroxylamine synthesis method | BEIJING LAVIANA PHARMATECH CO LTD | 2013-09-18 | — | — | CN | disclosed |
| CN-101143982-A | Ink composition for inkjet recording | SAMSUNG ELECTRONICS CO LTD (KR) | 2008-03-19 | — | — | CN | disclosed |
| CN-101078877-A | Colored photosensitive resin composition, color filter, image sensor, and camera system | SUMITOMO CHEMICAL CO (JP) | 2007-11-28 | — | — | CN | disclosed |
| CN-101078878-A | Colored photosensitive resin composition, color filter, image sensor, and camera system | SUMITOMO CHEMICAL CO (JP) | 2007-11-28 | — | — | CN | disclosed |