SCHEMBL18575422

SCHEMBL18575422

CC1c2ccccc2CC(C(=O)O)C1C(=O)O

nearest known ligand 0.45

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.45
LMNA P02545 1/20 0.45
POLB P06746 1/20 0.45
HDAC3 O15379 1/20 0.43
HDAC4 P56524 1/20 0.43
HDAC1 Q13547 1/20 0.43
HDAC7 Q8WUI4 1/20 0.43
HDAC2 Q92769 1/20 0.43
HDAC10 Q969S8 1/20 0.43
HDAC11 Q96DB2 1/20 0.43
HDAC8 Q9BY41 1/20 0.43
HDAC6 Q9UBN7 1/20 0.43
HDAC9 Q9UKV0 1/20 0.43
HDAC5 Q9UQL6 1/20 0.43
EDNRA P25101 4/20 0.41
EDNRB P24530 2/20 0.41
FABP5 Q01469 3/20 0.40
FABP7 O15540 2/20 0.40
MEN1 O00255 2/20 0.40
KMT2A Q03164 2/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4426516 0.88 HDAC3 (0.49) ALDH1A1LMNAPOLBHDAC3HDAC4
SCHEMBL4426521 0.88 HDAC3 (0.49) ALDH1A1LMNAPOLBHDAC3HDAC4
SCHEMBL4426518 0.88 HDAC3 (0.49) ALDH1A1LMNAPOLBHDAC3HDAC4
Hydrochloric Acid SCHEMBL9527737 0.86 HDAC3 (0.48) HDAC3HDAC4HDAC1HDAC7HDAC2
SCHEMBL9526600 0.77 HDAC3 (0.49) HDAC3HDAC4HDAC1HDAC7HDAC2
SCHEMBL9527316 0.77 HDAC3 (0.49) HDAC3HDAC4HDAC1HDAC7HDAC2
SCHEMBL9527726 0.76 HDAC3 (0.48) HDAC3HDAC4HDAC1HDAC7HDAC2
SCHEMBL6065374 0.76 EDNRA (0.54) POLBEDNRAEDNRBMEN1KMT2A
SCHEMBL6065513 0.76 EDNRA (0.54) POLBEDNRAEDNRBMEN1KMT2A
SCHEMBL3229949 0.76 EDNRA (0.54) POLBEDNRAEDNRBMEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4397492-A1 ADHESIVE, LAYERED BODY, METHOD FOR MANUFACTURING LAYERED BODY, AND PACKAGING MATERIAL DIC Corporation (JP) 2024-07-10 EP disclosed
EP-3138873-A1 EPOXY RESIN COMPOSITION AND PRINTED CIRCUIT BOARD COMPRISING INSULATING LAYER USING SAME LG Innotek Co., Ltd. (KR) 2017-03-08 EP disclosed