⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL20898290 | 0.97 | — | — | |
| SCHEMBL549356 | 0.97 | — | — | |
| SCHEMBL8008574 | 0.94 | — | — | |
| SCHEMBL1138591 | 0.94 | — | — | |
| SCHEMBL1138621 | 0.94 | — | — | |
| SCHEMBL4299562 | 0.94 | — | — | |
| SCHEMBL9392015 | 0.94 | — | — | |
| SCHEMBL19809590 | 0.94 | — | — | |
| Water SCHEMBL19282561 | 0.94 | SLC22A6 (0.40) | — | |
| SCHEMBL30153410 | 0.94 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-101403112-B | Chemical tin plating liquor for copper and copper alloy | KUNSHAN SHINGLEE SOLDER MANUFACTURE CO LTD | 2012-08-08 | — | — | CN | claimed |
| CN-101403112-A | Chemical tin plating liquor for copper and copper alloy | KUNSHAN SHINGLEE SOLDER MANUFA (CN) | 2009-04-08 | — | — | CN | claimed |
| EP-1591563-B1 | TIN-CONTAINING PLATING BATH | ISHIHARA CHEMICAL CO LTD (JP) | 2018-04-04 | — | — | EP | disclosed |
| CN-104785949-A | Solder powder doped with tin-plated alloyed powder and soldering paste containing solder powder | KUNSHAN SHING LEE SOLDERING MANUFACTURE CO LTD | 2015-07-22 | — | — | CN | disclosed |
| CN-101403112-B | Chemical tin plating liquor for copper and copper alloy | KUNSHAN SHINGLEE SOLDER MANUFACTURE CO LTD | 2012-08-08 | — | — | CN | disclosed |
| US-7938948-B2 | Silver and silver alloy plating bath | ISHIHARA CHEMICAL CO., LTD. (JP) | 2011-05-10 | — | — | US | disclosed |
| US-20090321269-A1 | SILVER AND SILVER ALLOY PLATING BATH | ISHIHARA CHEMICAL CO., LTD. (JP) | 2009-12-31 | — | — | US | disclosed |
| US-7628903-B1 | Silver and silver alloy plating bath | ISHIHARA CHEMICAL CO., LTD. (JP) | 2009-12-08 | — | — | US | disclosed |
| CN-101403112-A | Chemical tin plating liquor for copper and copper alloy | KUNSHAN SHINGLEE SOLDER MANUFA (CN) | 2009-04-08 | — | — | CN | disclosed |
| US-20060113006-A1 | Tin-containing plating bath | ISHIHARA CHEMICAL CO., LTD. (JP) | 2006-06-01 | — | — | US | disclosed |
| EP-1591563-A1 | TIN-CONTAINING PLATING BATH | Ishihara Chemical Co., Ltd. (JP) | 2005-11-02 | — | — | EP | disclosed |