SCHEMBL18635923

SCHEMBL18635923

CC1CCC(c2ccc(C(O)Oc3ccc(OC(O)c4ccc(C5CCC(C)CC5)cc4)cc3)cc2)CC1

nearest known ligand 0.51

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
▸ ESR2 Q92731 2/20 0.51
▸ ALDH1A1 P00352 1/20 0.36
▸ SIGMAR1 Q99720 2/20 0.35
▸ HPGD P15428 1/20 0.35
▸ HIF1A Q16665 1/20 0.35
▸ HRH3 Q9Y5N1 1/20 0.34
▸ KMT2A Q03164 2/20 0.34
▸ MEN1 O00255 1/20 0.34
▸ TSHR P16473 1/20 0.34
▸ MAPT P10636 1/20 0.34
▸ IDO1 P14902 1/20 0.33
▸ FFAR1 O14842 1/20 0.33
▸ RAB9A P51151 1/20 0.33
▸ SLC6A2 P23975 1/20 0.33
▸ SLC6A4 P31645 1/20 0.33
▸ SLC6A3 Q01959 1/20 0.33
▸ DRD2 P14416 1/20 0.32
▸ POLB P06746 1/20 0.32
▸ ACACB O00763 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL21425138 0.94 ESR2 (0.46) ESR2ALDH1A1SIGMAR1HPGDHIF1A
SCHEMBL21425139 0.90 ESR2 (0.43) ESR2ALDH1A1KMT2AMEN1MAPT
SCHEMBL20758751 0.87 ESR2 (0.40) ESR2ALDH1A1HPGDMAPTIDO1
SCHEMBL23158850 0.83 ESR2 (0.42) ESR2HIF1AHRH3SLC6A2SLC6A4
SCHEMBL18636444 0.81 KMT2A (0.40) ESR2ALDH1A1HRH3KMT2AMEN1
SCHEMBL14924284 0.78 ESR2 (0.52) ESR2ALDH1A1HRH3KMT2AMEN1
SCHEMBL23142714 0.77 ESR2 (0.59) ESR2HRH3RAB9ASLC6A2SLC6A4
SCHEMBL13969901 0.75 ESR2 (0.62) ESR2HRH3RAB9ASLC6A2SLC6A4
SCHEMBL14207673 0.75 ESR2 (0.49) ESR2SIGMAR1HPGDHRH3KMT2A
SCHEMBL9061943 0.74 ESR2 (0.47) ESR2ALDH1A1HRH3KMT2AMEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3141589-A1 COMPOSITION FOR HEAT-DISSIPATION MEMBERS, HEAT-DISSIPATION MEMBER, AND ELECTRONIC DEVICE JNC Corporation (JP) 2017-03-15 — — EP disclosed
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