SCHEMBL18636208

SCHEMBL18636208

Cc1ccc(C(=O)Oc2ccc3c(c2)Cc2cc(OC(=O)c4ccc(C)cc4)ccc2-3)cc1

nearest known ligand 0.55

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ KMT2A Q03164 9/20 0.52
▸ LMNA P02545 1/20 0.52
▸ GBA1 P04062 1/20 0.51
▸ GAA P10253 1/20 0.49
▸ HPGD P15428 1/20 0.49
▸ PRSS1 P07477 1/20 0.49
▸ ACR P10323 1/20 0.49
▸ NPC1 O15118 2/20 0.49
▸ RAB9A P51151 2/20 0.49
▸ MAPT P10636 2/20 0.49
▸ CYP1A2 P05177 1/20 0.48
▸ CYP2C9 P11712 1/20 0.48
▸ MEN1 O00255 3/20 0.47
▸ MAOA P21397 1/20 0.45
▸ MAOB P27338 1/20 0.45
▸ TDP1 Q9NUW8 1/20 0.44
▸ ALDH1A1 P00352 2/20 0.44
▸ SMN1; SMN2 Q16637 1/20 0.44
▸ RXFP1 Q9HBX9 1/20 0.44
▸ S100A4 P26447 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL18635965 0.96 KMT2A (0.49) KMT2ALMNAGBA1GAAHPGD
SCHEMBL14579690 0.82 MAPT (0.55) KMT2ALMNAGBA1HPGDPRSS1
SCHEMBL12353111 0.82 KMT2A (0.45) KMT2ALMNAGBA1GAAHPGD
SCHEMBL12633719 0.80 KMT2A (0.68) KMT2ALMNAGBA1GAAHPGD
SCHEMBL8929987 0.79 PRSS1 (0.69) KMT2ALMNAGBA1GAAHPGD
SCHEMBL2741098 0.79 PRSS1 (0.69) KMT2ALMNAGBA1GAAHPGD
SCHEMBL1101878 0.79 PRSS1 (0.69) KMT2ALMNAGBA1GAAHPGD
SCHEMBL8930157 0.79 PRSS1 (0.69) KMT2ALMNAGBA1GAAHPGD
SCHEMBL9663961 0.79 PRSS1 (0.69) KMT2ALMNAGBA1GAAHPGD
SCHEMBL20757713 0.79 HIF1A (0.46) KMT2ANPC1RAB9AMAPTCYP1A2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20210187902-A1 LAMINATE, ELECTRONIC DEVICE, AND PRODUCTION METHOD FOR LAMINATE JNC CORPORATION (JP) 2021-06-24 — — US disclosed
US-20210101373-A1 LAMINATE, ELECTRONIC EQUIPMENT AND PRODUCTION METHOD FOR LAMINATE JNC CORPORATION (JP) 2021-04-08 — — US disclosed
US-20190055444-A1 COMPOSITION FOR LOW THERMAL EXPANSION MEMBERS, LOW THERMAL EXPANSION MEMBER, ELECTRONIC DEVICE, AND METHOD FOR PRODUCING LOW THERMAL EXPANSION MEMBER JNC CORPORATION (JP) 2019-02-21 — — US disclosed
US-10202530-B2 Composition for heat-dissipation members, heat-dissipation member, electronic device, and method of producing heat dissipating member JNC CORPORATION (JP) 2019-02-12 — — US disclosed
US-9938371-B2 Composition for heat-dissipation member, heat-dissipation member, and electronic device JNC CORPORATION (JP) 2018-04-10 — — US disclosed
US-9938371-B2 Composition for heat-dissipation member, heat-dissipation member, and electronic device JNC CORPORATION (JP) 2018-04-10 — — US disclosed
US-20170306207-A1 COMPOSITION FOR HEAT-DISSIPATION MEMBERS, HEAT-DISSIPATION MEMBER, ELECTRONIC DEVICE, AND HEAT-DISSIPATION-MEMBER PRODUCTION METHOD JNC CORPORATION (JP) 2017-10-26 — — US disclosed
US-20170306207-A1 COMPOSITION FOR HEAT-DISSIPATION MEMBERS, HEAT-DISSIPATION MEMBER, ELECTRONIC DEVICE, AND HEAT-DISSIPATION-MEMBER PRODUCTION METHOD JNC CORPORATION (JP) 2017-10-26 — — US disclosed
EP-3211018-A1 COMPOSITION FOR HEAT-DISSIPATION MEMBERS, HEAT-DISSIPATION MEMBER, ELECTRONIC DEVICE, AND HEAT-DISSIPATION-MEMBER PRODUCTION METHOD JNC Corporation (JP) 2017-08-30 — — EP disclosed
US-20170137561-A1 COMPOSITION FOR HEAT-DISSIPATION MEMBERS, HEAT-DISSIPATION MEMBER, AND ELECTRONIC DEVICE JNC CORPORATION (JP) 2017-05-18 — — US disclosed
US-20170137561-A1 COMPOSITION FOR HEAT-DISSIPATION MEMBERS, HEAT-DISSIPATION MEMBER, AND ELECTRONIC DEVICE JNC CORPORATION (JP) 2017-05-18 — — US disclosed
EP-3141589-A1 COMPOSITION FOR HEAT-DISSIPATION MEMBERS, HEAT-DISSIPATION MEMBER, AND ELECTRONIC DEVICE JNC Corporation (JP) 2017-03-15 — — EP disclosed
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