⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28825673 | 0.82 | TSHR (0.31) | — | |
| SCHEMBL21165222 | 0.82 | — | — | |
| SCHEMBL824970 | 0.77 | — | — | |
| SCHEMBL14218439 | 0.77 | — | — | |
| SCHEMBL10392136 | 0.77 | ABL1 (0.34) | — | |
| SCHEMBL10392135 | 0.77 | ABL1 (0.31) | — | |
| SCHEMBL762566 | 0.75 | — | — | |
| SCHEMBL16060841 | 0.74 | ATM (0.31) | — | |
| SCHEMBL16060840 | 0.74 | ATM (0.31) | — | |
| SCHEMBL8544746 | 0.74 | CHRM2 (0.37) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8338075-B2 | Base component which exhibits increased solubility in an alkali developing solution under the action of acid, an acid generator, and organic solvent having a boiling point of at least 150 degrees C.; hole-like resist pattern can be formed with a high level of resolution and minute dimensions | TOKYO OHKA KOGYO CO., LTD. (JP) | 2012-12-25 | — | — | US | disclosed |
| US-7939243-B2 | Resin, resist composition and method of forming resist pattern | TOKYO OHKA KOGYO CO., LTD. (JP) | 2011-05-10 | — | — | US | disclosed |
| US-20100159389-A1 | RESIN, RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN | TOKYO OHKA KOGYO CO., LTD. (JP) | 2010-06-24 | — | — | US | disclosed |
| US-20100047724-A1 | POSITIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN | TOKYO OHKA KOGYO CO., LTD. (JP) | 2010-02-25 | — | — | US | disclosed |