Predicted protein targets (top 12)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | GLA | P06280 | 1/20 | 0.36 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.36 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.34 |
| ▸ | MAPT | P10636 | 2/20 | 0.33 |
| ▸ | LMNA | P02545 | 1/20 | 0.33 |
| ▸ | IAPP | P10997 | 2/20 | 0.33 |
| ▸ | PTGS1 | P23219 | 1/20 | 0.33 |
| ▸ | MEN1 | O00255 | 1/20 | 0.33 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.33 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.33 |
| ▸ | GAA | P10253 | 1/20 | 0.31 |
| ▸ | HTT | P42858 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL15390555 | 0.86 | HCAR2 (0.34) | GLATDP1KDM4EMAPTLMNA | |
| SCHEMBL7185798 | 0.86 | HCAR2 (0.34) | GLATDP1KDM4EMAPTLMNA | |
| SCHEMBL15389876 | 0.84 | — | — | |
| SCHEMBL521742 | 0.81 | CA12 (0.40) | KDM4EMAPTMEN1ALDH1A1KMT2A | |
| SCHEMBL9081365 | 0.80 | — | — | |
| SCHEMBL9410613 | 0.76 | APP (0.44) | KDM4ELMNAALDH1A1HTT | |
| SCHEMBL9605416 | 0.73 | GLA (0.41) | GLATDP1KDM4EMAPTLMNA | |
| SCHEMBL9605417 | 0.73 | GLA (0.41) | GLATDP1KDM4EMAPTLMNA | |
| SCHEMBL1253974 | 0.72 | — | — | |
| SCHEMBL1245196 | 0.71 | KDM4E (0.30) | KDM4EMAPTALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3238861-B1 | SOLDER MATERIAL, SOLDER PASTE, FOAM SOLDER, FLUX COATING MATERIAL | SENJU METAL INDUSTRY CO (JP) | 2025-08-27 | — | — | EP | disclosed |
| US-10888959-B2 | Cu core ball, solder joint, solder paste and formed solder | SENJU METAL INDUSTRY CO., LTD. (JP) | 2021-01-12 | — | — | US | disclosed |
| US-10675719-B2 | Joining member, solder material, solder paste, formed solder, flux coated material, and solder joint | SENJU METAL INDUSTRY CO., LTD. (JP) | 2020-06-09 | — | — | US | disclosed |
| CN-107107188-B | Solder material, solder paste, formed solder, flux coating material, and soldered joint | 千住金属工业株式会社 | 2019-09-17 | — | — | CN | disclosed |
| US-10062657-B2 | Method for manufacturing alloy bump | ISHIHARA CHEMICAL CO., LTD. (JP) | 2018-08-28 | — | — | US | disclosed |
| US-20180015572-A1 | Joining Member, Solder Material, Solder Paste, Formed Solder, Flux Coated Material, and Solder Joint | SENJU METAL INDUSTRY CO., LTD. (JP) | 2018-01-18 | — | — | US | disclosed |
| US-20170330850-A1 | METHOD FOR MANUFACTURING ALLOY BUMP | ISHIHARA CHEMICAL CO., LTD. (JP) | 2017-11-16 | — | — | US | disclosed |
| EP-3238861-A1 | JOINING MEMBER, SOLDER MATERIAL, SOLDER PASTE, FOAM SOLDER, FLUX COATING MATERIAL, AND SOLDER JOINT | Senju Metal Industry Co., Ltd (JP) | 2017-11-01 | — | — | EP | disclosed |
| EP-3206225-A1 | METHOD FOR MANUFACTURING ALLOY BUMP | Ishihara Chemical Co., Ltd. (JP) | 2017-08-16 | — | — | EP | disclosed |
| US-7938948-B2 | Silver and silver alloy plating bath | ISHIHARA CHEMICAL CO., LTD. (JP) | 2011-05-10 | — | — | US | disclosed |
| US-20090321269-A1 | SILVER AND SILVER ALLOY PLATING BATH | ISHIHARA CHEMICAL CO., LTD. (JP) | 2009-12-31 | — | — | US | disclosed |
| US-7628903-B1 | Silver and silver alloy plating bath | ISHIHARA CHEMICAL CO., LTD. (JP) | 2009-12-08 | — | — | US | disclosed |
| EP-0196232-B1 | PLATING BATH AND METHOD FOR ELECTROPLATING TIN AND/OR LEAD | MCGEAN-ROHCO, INC. (US) | 1991-11-21 | — | — | EP | disclosed |
| EP-0196232-A2 | Plating bath and method for electroplating tin and/or lead | MCGEAN-ROHCO, INC. (US) | 1986-10-01 | — | — | EP | disclosed |
| US-4582576-A | LEAD OR TIN SALT A SULFONIC ACID, SURFACTANT, AND BRIGHTENERS | MCGEAN-ROHCO, INC. (US) | 1986-04-15 | — | — | US | disclosed |