SCHEMBL186608

SCHEMBL186608

CCO[PH](=O)CC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL258500 0.97
SCHEMBL246899 0.97
SCHEMBL28087411 0.97
SCHEMBL258473 0.97
SCHEMBL17600696 0.97
SCHEMBL248392 0.97
Ammonia Solution, Strong SCHEMBL2354181 0.97
SCHEMBL17600699 0.97
SCHEMBL28102619 0.97
SCHEMBL28206052 0.94

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1758 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115974915-B Dialkyl phosphinic acid hybrid salt and preparation method and application thereof NINGBO INSTITUTE OF MATERIALS TECHNOLOGY & ENGINEERING, CHINESE ACADEMY OF SCIENCES (CN) 2026-05-26 CN claimed
US-20250333593-A1 Fire Resistant Two-Part System ZEPHYROS INC (US) 2025-10-30 US claimed
WO-2025131748-A1 PYROTECHNIC CIRCUIT BREAKER COMPRISING A POLYMER COMPOSITION BASED ON A POLYPHTALAMIDE SOLVAY SPECIALTY POLYMERS USA, LLC (US) 2025-06-26 WO claimed
CN-119307006-B Polymer additive and preparation method and application thereof 上海金发科技发展有限公司 2025-06-03 CN claimed
CN-119798785-B Polymer additive, preparation method and polymer composition 上海金发科技发展有限公司 2025-06-03 CN claimed
CN-120040967-A Polymer additive and preparation method and application thereof 金发科技股份有限公司 2025-05-27 CN claimed
CN-119798785-A Polymer additive, preparation method and polymer composition 上海金发科技发展有限公司 2025-04-11 CN claimed
US-20250051512-A1 POLYBUTYLENE TEREPHTHALATE RESIN COMPOSITION, METHOD OF PREPARING THE SAME, AND MOLDED ARTICLE INCLUDING THE SAME LG CHEM, LTD. (KR) 2025-02-13 US claimed
CN-119307006-A Polymer additive and preparation method and application thereof 上海金发科技发展有限公司 2025-01-14 CN claimed
CN-119307007-A Polymer additive, flame retardant, polymer molding material, preparation method and application thereof 上海金发科技发展有限公司 2025-01-14 CN claimed
EP-2084218-B1 FLAME RETARDANT THERMOPLASTIC ELASTOMER COMPOSITIONS DU PONT (US) 2010-12-22 EP claimed
WO-2010097656-A1 COMPOSITIONS AND METHODS FOR PERFORMING A STRINGENT WASH STEP IN HYBRIDIZATION APPLICATIONS DAKO DENMARK A/S (DK) 2010-09-02 WO claimed
WO-2010097655-A1 COMPOSITIONS AND METHODS FOR RNA HYBRIDIZATION APPLICATIONS DAKO DENMARK A/S (DK) 2010-09-02 WO claimed
WO-2010097707-A1 COMPOSITIONS AND METHODS FOR PERFORMING HYBRIDIZATIONS WITH SEPARATE DENATURATION OF THE SAMPLE AND PROBE DAKO DENMARK A/S (DK) 2010-09-02 WO claimed
WO-2009147537-A2 COMPOSITIONS AND METHODS FOR DETECTION OF CHROMOSOMAL ABERRATIONS WITH NOVEL HYBRIDIZATION BUFFERS DAKO DENMARK A/S (DK) 2009-12-10 WO claimed
WO-2009144581-A1 HYBRIDIZATION COMPOSITIONS AND METHODS DAKO DENMARK A/S (DK) 2009-12-03 WO claimed
CN-101496115-A Insulated wire and use thereof in electronic devices DSM IP ASSETS BV (NL) 2009-07-29 CN claimed
US-7208539-B2 Thermosetting resin composition, and prepreg and laminated board using the same HITACHI CHEMICAL CO., LTD. (JP) 2007-04-24 US claimed
CN-1894319-A Flame-retardant polyester composition GEN ELECTRIC (US) 2007-01-10 CN claimed
CN-1238423-C Thermoplastic resin composition and molded object thereof POLYPLASTICS CO (JP) 2006-01-25 CN claimed