Predicted protein targets (top 18)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TET2 | Q6N021 | 4/20 | 0.38 |
| ▸ | TET3 | O43151 | 1/20 | 0.38 |
| ▸ | TET1 | Q8NFU7 | 1/20 | 0.38 |
| ▸ | PTPN1 | P18031 | 1/20 | 0.38 |
| ▸ | FFAR4 | Q5NUL3 | 1/20 | 0.36 |
| ▸ | FFAR1 | O14842 | 1/20 | 0.36 |
| ▸ | THRB | P10828 | 1/20 | 0.36 |
| ▸ | NFKB1 | P19838 | 1/20 | 0.35 |
| ▸ | TBXAS1 | P24557 | 2/20 | 0.33 |
| ▸ | ACACB | O00763 | 1/20 | 0.32 |
| ▸ | ACACA | Q13085 | 1/20 | 0.32 |
| ▸ | GRIK1 | P39086 | 1/20 | 0.32 |
| ▸ | GRIK2 | Q13002 | 1/20 | 0.32 |
| ▸ | GRM1 | Q13255 | 1/20 | 0.32 |
| ▸ | GRM2 | Q14416 | 1/20 | 0.32 |
| ▸ | GPR84 | Q9NQS5 | 1/20 | 0.31 |
| ▸ | FAAH | O00519 | 1/20 | 0.30 |
| ▸ | CAMK2A | Q9UQM7 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2589076 | 0.88 | TET2 (0.40) | TET2TET3TET1PTPN1FFAR4 | |
| SCHEMBL164149 | 0.86 | TET2 (0.39) | TET2TET3TET1PTPN1FFAR4 | |
| SCHEMBL17583231 | 0.82 | PTPN1 (0.44) | TET2TET3TET1PTPN1FFAR4 | |
| SCHEMBL1686044 | 0.80 | FFAR4 (0.40) | TET2TET3TET1FFAR4FFAR1 | |
| SCHEMBL9327540 | 0.79 | FFAR1 (0.62) | FFAR4FFAR1NFKB1GPR84FAAH | |
| SCHEMBL8616691 | 0.79 | FFAR4 (0.55) | TET2PTPN1FFAR4FFAR1THRB | |
| SCHEMBL13450043 | 0.79 | FFAR4 (0.55) | TET2PTPN1FFAR4FFAR1THRB | |
| SCHEMBL1401880 | 0.79 | TET2 (0.43) | TET2TET3TET1TBXAS1GRIK1 | |
| SCHEMBL9069443 | 0.78 | FFAR4 (0.43) | TET2TET3TET1PTPN1FFAR4 | |
| SCHEMBL979733 | 0.78 | FFAR4 (0.61) | PTPN1FFAR4FFAR1NFKB1FAAH |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-9929348-B2 | Organic semiconductor composition comprising organic semiconductor material and polymer compound | FUJIFILM CORPORATION (JP) | 2018-03-27 | — | — | US | disclosed |
| EP-2236647-B1 | PROCESS FOR ADSORBING PLATING CATALYSTS, PROCESS FOR PRODUCTION OF SUBSTRATES PROVIDED WITH METAL LAYERS AND PLATING CATALYST CONTAINING FLUID FOR USE IN BOTH PROCESSES | FUJIFILM CORP (JP) | 2018-02-21 | — | — | EP | disclosed |
| US-20160071624-A1 | ORGANIC SEMICONDUCTOR COMPOSITION, ORGANIC THIN-FILM TRANSISTOR, ELECTRONIC PAPER, AND DISPLAY DEVICE | FUJIFILM CORPORATION (JP) | 2016-03-10 | — | — | US | disclosed |
| US-20160064674-A1 | ORGANIC SEMICONDUCTOR COMOSITION, ORGANIC THIN-FILM TRANSISTOR, ELECTRONIC PAPER, AND DISPLAY DEVICE | FUJIFILM CORPORATION (JP) | 2016-03-03 | — | — | US | disclosed |
| US-8293846-B2 | Composition for forming layer to be plated, method of producing metal pattern material, metal pattern material | FUJIFILM CORPORATION (JP) | 2012-10-23 | — | — | US | disclosed |
| US-8273463-B2 | Multilayer film for plating, method of manufacturing metal film-coated material and metal film-coated material | FUJIFILM CORPORATION (JP) | 2012-09-25 | — | — | US | disclosed |
| US-20110104454-A1 | COMPOSITION FOR FORMING LAYER TO BE PLATED, METHOD OF PRODUCING METAL PATTERN MATERIAL, AND METAL PATTERN MATERIAL | FUJIFILM CORPORATION (JP) | 2011-05-05 | — | — | US | disclosed |
| US-20100279012-A1 | METHOD FOR ADSORBING PLATING CATALYST, METHOD FOR PREPARING SUBSTRATE PROVIDED WITH METAL LAYER, AND PLATING CATALYST SOLUTION USED IN THE SAME | FUJIFILM CORPORATION (JP) | 2010-11-04 | — | — | US | disclosed |
| US-20100273014-A1 | METAL-CLAD SUBSTRATE, AND METHOD FOR PRODUCTION THEREOF | FUJIFILM CORPORATION (JP) | 2010-10-28 | — | — | US | disclosed |
| US-20100272902-A1 | PLATING METHOD, METHOD FOR FORMING METAL THIN FILM, AND PLATING CATALYST LIQUID | FUJIFILM CORPORATION (JP) | 2010-10-28 | — | — | US | disclosed |
| EP-2236647-A1 | PROCESS FOR ADSORBING PLATING CATALYSTS, PROCESS FOR PRODUCTION OF SUBSTRATES PROVIDED WITH METAL LAYERS AND PLATING CATALYST CONTAINING FLUID FOR USE IN BOTH PROCESSES | FUJIFILM Corporation (JP) | 2010-10-06 | — | — | EP | disclosed |
| US-20100247880-A1 | NOVEL COPOLYMER, NOVEL COPOLYMER-CONTAINING COMPOSITION, LAMINATE BODY, METHOD OF PRODUCING METAL FILM-COATED MATERIAL, METAL FILM-COATED MATERIAL, METHOD OF PRODUCING METALLIC PATTERN-BEARING MATERIAL AND METALLIC PATTERN-BEARING MATERIAL | FUJIFILM CORPORATION (JP) | 2010-09-30 | — | — | US | disclosed |
| US-20100080964-A1 | COMPOSITION FOR FORMING LAYER TO BE PLATED, METHOD OF PRODUCING METAL PATTERN MATERIAL, METAL PATTERN MATERIAL | FUJIFILM CORPORATION (JP) | 2010-04-01 | — | — | US | disclosed |
| US-20100003533-A1 | METAL-FILM-COATED MATERIAL AND PROCESS FOR PRODUCING THE SAME, METALLIC-PATTERN-BEARING MATERIAL AND PROCESS FOR PRODUCING THE SAME, COMPOSITION FOR POLYMER LAYER FORMATION, NITRILE GROUP-CONTAINING POLYMER AND METHOD OF SYNTHESIZING THE SAME, COMPOSITION CONTAINING NITRILE GROUP-CONTAINING POLYMER, AND LAMINATE | FUJIFILM CORPORATION (JP) | 2010-01-07 | — | — | US | disclosed |
| US-20090269599-A1 | MULTILAYER FILM FOR PLATING, METHOD OF MANUFACTURING METAL FILM-COATED MATERIAL AND METAL FILM-COATED MATERIAL | FUJIFILM CORPORATION (JP) | 2009-10-29 | — | — | US | disclosed |
| US-20090155553-A1 | Method of manufacturing surface metal film material, surface metal film material, method of manufacturing patterned metal material, patterned metal material, and polymer layer-forming composition | FUJIFILM CORPORATION (JP) | 2009-06-18 | — | — | US | disclosed |