⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Hydroxyamine SCHEMBL28336776 | 1.00 | — | — | |
| Hydroxyamine SCHEMBL6572294 | 0.89 | — | — | |
| Hydroxyamine SCHEMBL3273025 | 0.87 | — | — | |
| Hydroxyamine SCHEMBL15869353 | 0.87 | — | — | |
| Hydroxyamine SCHEMBL1248 | 0.87 | — | — | |
| Hydroxyamine SCHEMBL23327360 | 0.75 | — | — | |
| Hydroxyamine SCHEMBL10610314 | 0.75 | — | — | |
| Hydroxyamine SCHEMBL2224589 | 0.75 | — | — | |
| Hydroxyamine SCHEMBL351722 | 0.75 | — | — | |
| Hydroxyamine SCHEMBL22441580 | 0.75 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 152 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-6413923-B1 | — | — | None | — | — | US | claimed |
| WO-2026099847-A1 | SYNTHESIS OF CYANO-ANTHRANILIC ACID | ADAMA MAKHTESHIM LTD. (IL) | 2026-05-15 | — | — | WO | claimed |
| CN-112658527-A | Leadless low-temperature soldering tin | 苏州雷盾新材料科技有限公司 | 2021-04-16 | — | — | CN | claimed |
| CN-111440088-A | Oximation of KA oil by-product | 艾德凡斯化学公司 | 2020-07-24 | — | — | CN | claimed |
| CN-111085797-A | Lead-free aluminum soldering tin wire and preparation method thereof | 乐清市荣兴金属材料有限公司 | 2020-05-01 | — | — | CN | claimed |
| EP-2970075-B1 | OXIMATION OF KA OIL BY-PRODUCT | ADVANSIX RESINS & CHEMICALS LLC (US) | 2019-02-20 | — | — | EP | claimed |
| US-9382195-B2 | Oximation of KA oil by-product | HONEYWELL INTERNATIONAL INC. (US) | 2016-07-05 | — | — | US | claimed |
| EP-2970075-A1 | OXIMATION OF KA OIL BY-PRODUCT | Honeywell International Inc. (US) | 2016-01-20 | — | — | EP | claimed |
| WO-2014159508-A1 | OXIMATION OF KA OIL BY-PRODUCT | HONEYWELL INTERNATIONAL INC. (US) | 2014-10-02 | — | — | WO | claimed |
| US-20140275627-A1 | OXIMATION OF KA OIL BY-PRODUCT | HONEYWELL INTERNATIONAL INC. (US) | 2014-09-18 | — | — | US | claimed |
| WO-2003091377-A1 | NON-CORROSIVE CLEANING COMPOSITIONS FOR REMOVING ETCH RESIDUES | ARCH SPECIALITY CHEMICALS, INC. (US) | 2003-11-06 | — | — | WO | claimed |
| EP-1070157-A4 | METHOD FOR REMOVING PHOTORESIST AND PLASMA ETCH RESIDUES | ARCH SPEC CHEM INC (US) | 2003-02-12 | — | — | EP | claimed |
| US-20020132745-A1 | Non-corrosive cleaning composition for removing plasma etching residues | ARCH SPECIALTY CHEMICALS | 2002-09-19 | — | — | US | claimed |
| EP-1230334-A1 | NON-CORROSIVE CLEANING COMPOSITION FOR REMOVING PLASMA ETCHING RESIDUES | ARCH SPECIALTY CHEMICALS, INC. (US) | 2002-08-14 | — | — | EP | claimed |
| US-6413923-B2 | A CLEANING COMPOSITION FOR REMOVING PLASMA ETCH RESIDUES FORMED ON A SUBSTRATE WHICH COMPRISES WATER, ATLEAST ONE HYDROXYLAMMONIUM INORGANIC OR ORGANIC COMPOUND, A BASIC COMPOUND AND AN ORGANIC CARBOXYLLIC ACID | ARCH SPECIALTY CHEMICALS, INC. | 2002-07-02 | — | — | US | claimed |
| US-6245155-B1 | CLEANING COMPOSITION COMPRISES WATER, HYDROXYLAMMONIUM COMPOUND, AT LEAST ONE BASIC AMINE OR QUATERNARY AMMONIUM HYDROXIDE, AND OPTIONALLY A CHELATING STABILIZER, AND A SURFACTANT. | ARCH SPECIALTY CHEMICALS, INC. | 2001-06-12 | — | — | US | claimed |
| WO-2001036578-A1 | NON-CORROSIVE CLEANING COMPOSITION FOR REMOVING PLASMA ETCHING RESIDUES | ARCH SPECIALTY CHEMICALS, INC. (US) | 2001-05-25 | — | — | WO | claimed |
| US-20010001785-A1 | NON-CORROSIVE CLEANING COMPOSITION FOR REMOVING PLASMA ETCHING RESIDUES | KENJI HONDA | 2001-05-24 | — | — | US | claimed |
| EP-1070157-A1 | METHOD FOR REMOVING PHOTORESIST AND PLASMA ETCH RESIDUES | Arch Specialty Chemicals, Inc. (US) | 2001-01-24 | — | — | EP | claimed |
| WO-1999051796-A1 | METHOD FOR REMOVING PHOTORESIST AND PLASMA ETCH RESIDUES | OLIN MICROELECTRONIC CHEMICALS, INC. (US) | 1999-10-14 | — | — | WO | claimed |