SCHEMBL18722693

SCHEMBL18722693

O=C1OC(=O)C23CCCC1C(CCC2)C(=O)OC3=O

nearest known ligand 0.33

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TP53 P04637 3/20 0.30
CYP3A4 P08684 3/20 0.30
MAPK1 P28482 3/20 0.30
HIF1A Q16665 2/20 0.30
LMNA P02545 2/20 0.30
CYP1A2 P05177 2/20 0.30
SMN1; SMN2 Q16637 2/20 0.30
NPC1 O15118 2/20 0.30
RAB9A P51151 2/20 0.30
NFKB1 P19838 1/20 0.30
THPO P40225 1/20 0.30
PPM1B O75688 1/20 0.30
PTPN1 P18031 1/20 0.30
PPP1CC P36873 1/20 0.30
TFPI2 P48307 1/20 0.30
PPP5C P53041 1/20 0.30
PPP2CA P67775 1/20 0.30
PPP1CA P62136 1/20 0.30
KDM4E B2RXH2 1/20 0.30
GMNN O75496 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL336246 0.75 KDM4E (0.42) TP53LMNASMN1; SMN2RAB9ANFKB1
SCHEMBL34170 0.75 KDM4E (0.42) TP53LMNASMN1; SMN2RAB9ANFKB1
SCHEMBL18923859 0.75 KDM4E (0.42) TP53LMNASMN1; SMN2RAB9ANFKB1
SCHEMBL45891 0.75 KDM4E (0.42) TP53LMNASMN1; SMN2RAB9ANFKB1
SCHEMBL430025 0.75
SCHEMBL6377360 0.75 MAPK1 (0.32) TP53CYP3A4MAPK1HIF1ALMNA
SCHEMBL5525143 0.75 KDM4E (0.42) TP53LMNASMN1; SMN2RAB9ANFKB1
SCHEMBL6237465 0.75 KDM4E (0.42) TP53LMNASMN1; SMN2RAB9ANFKB1
SCHEMBL598374 0.75 KDM4E (0.42) TP53LMNASMN1; SMN2RAB9ANFKB1
SCHEMBL4968628 0.75 KDM4E (0.42) TP53LMNASMN1; SMN2RAB9ANFKB1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9618666-B2 Near-infrared-absorbing composition, near-infrared cut-off filter using same, manufacturing method therefor, camera module, and manufacturing method therefor FUJIFILM CORPORATION (JP) 2017-04-11 US disclosed