SCHEMBL18751634

SCHEMBL18751634

C[Si]1(CCC2CC3CC2C2OC32)O[Si](C)(CCC2CC3CC2C2OC32)O[Si](C)(CCC2CC3CC2C2OC32)O[Si](C)(CCC2CC3CC2C2OC32)O1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL24490469 1.00
SCHEMBL18768692 0.87
SCHEMBL24496976 0.84
SCHEMBL18768693 0.77
SCHEMBL24497038 0.73
SCHEMBL13058413 0.73
SCHEMBL15800754 0.72
SCHEMBL10158257 0.72
SCHEMBL14517853 0.71
SCHEMBL9621321 0.71 ADORA2A (0.31)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240239922-A1 PHOTOCURABLE COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2024-07-18 US disclosed
US-20230242692-A1 COMPOSITION AND CURED PRODUCT TOKYO OHKA KOGYO CO., LTD. (JP) 2023-08-03 US disclosed
US-9963542-B2 Silicone-modified epoxy resin, composition containing the epoxy resin, and cured product of same SHIN-ETSU CHEMICAL CO., LTD. (JP) 2018-05-08 US disclosed
US-20170107322-A1 SILICONE-MODIFIED EPOXY RESIN, COMPOSITION CONTAINING THE EPOXY RESIN, AND CURED PRODUCT OF SAME NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2017-04-20 US disclosed