SCHEMBL1883308

SCHEMBL1883308

C=CCCCC=C(C)C=C

nearest known ligand 0.42

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
TSHR P16473 5/20 0.42
ALDH1A1 P00352 3/20 0.42
MAPT P10636 2/20 0.33
LMNA P02545 2/20 0.33
ABCC4 O15439 1/20 0.33
TP53 P04637 1/20 0.30
USP2 O75604 1/20 0.30
CYP3A4 P08684 1/20 0.30
RECQL P46063 1/20 0.30
SMN1; SMN2 Q16637 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17838055 0.85 TSHR (0.48) TSHRALDH1A1MAPTLMNACYP3A4
SCHEMBL17838054 0.85 TSHR (0.48) TSHRALDH1A1MAPTLMNACYP3A4
SCHEMBL1002035 0.84
SCHEMBL1002034 0.84
SCHEMBL108957 0.80
SCHEMBL7121091 0.80
SCHEMBL29120874 0.80
SCHEMBL9642093 0.80
SCHEMBL43730 0.79
SCHEMBL7646026 0.78 TSHR (0.48) TSHRALDH1A1MAPTLMNAUSP2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 70 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3520995-B1 MOLD FOR MANUFACTURING A RESIN-LAMINATED BOARD KYORAKU CO LTD (JP) 2021-10-13 EP disclosed
US-10864669-B2 Molten-resin extrusion device and extrusion method as well as molten resin molding machine and molding method KYORAKU CO., LTD. (JP) 2020-12-15 US disclosed
US-10821700-B2 Method of manufacturing a resin-laminated board KYORAKU CO., LTD. (JP) 2020-11-03 US disclosed
EP-3159154-B1 RESIN SANDWICH PANEL AND RESIN SANDWICH PANEL MANUFACTURING METHOD KYORAKU CO LTD (JP) 2020-08-19 EP disclosed
US-10682804-B2 Molding method and molding apparatus for resin molded article KYORAKU CO., LTD. (JP) 2020-06-16 US disclosed
EP-2728272-B1 DUCT KYORAKU CO LTD (JP) 2020-03-04 EP disclosed
EP-3287255-B1 MOLTEN RESIN EXTRUSION DEVICE AND EXTRUSION METHOD AS WELL AS MOLTEN RESIN MOLDING APPARATUS AND MOLDING METHOD KYORAKU CO LTD (JP) 2019-08-28 EP disclosed
EP-3520995-A1 METHOD AND MOLD FOR MANUFACTURING A RESIN-LAMINATED BOARD Kyoraku Co., Ltd. (JP) 2019-08-07 EP disclosed
US-10350797-B2 Method for manufacturing a sandwich panel KYORAKU CO., LTD. (JP) 2019-07-16 US disclosed
EP-2500194-B1 Impact energy absorber for vehicle and method for forming the same KYORAKU CO LTD (JP) 2019-07-03 EP disclosed
EP-2620390-A1 MODULE USED FOR STACKING THIN PLATE PANELS Hitachi Transport System, Ltd. (JP) 2013-07-31 EP disclosed
US-20130114155-A1 REFLECTIVE PANEL FOR SOLAR POWER GENERATION KONICA MINOLTA LAYERS, INC. (JP) 2013-05-09 US disclosed
EP-2587282-A1 REFLECTIVE PANEL FOR SOLAR POWER GENERATION Konica Minolta Advanced Layers, Inc. (JP) 2013-05-01 EP disclosed
US-20120235443-A1 IMPACT ENERGY ABSORBER FOR VEHICLE AND METHOD FOR FORMING THE SAME KYORAKU CO., LTD. (JP) 2012-09-20 US disclosed
EP-2500194-A2 Impact energy absorber for vehicle and method for forming the same Kyoraku Co., Ltd. (JP) 2012-09-19 EP disclosed
CN-102686379-A Method for manufacturing a resin laminate KYORAKU CO LTD 2012-09-19 CN disclosed
US-20120205038-A1 METHOD FOR FORMING RESIN MOLDED ARTICLES, APPARATUS FOR FORMING RESIN MOLDED ARTICLES, AND APPARATUS FOR ADJUSTING THICKNESS OF THERMOPLASTIC RESIN SHEET KYORAKU CO., LTD. (JP) 2012-08-16 US disclosed
CN-102202881-A Sandwich panel, method of forming core material for sandwich panel, and method of forming sandwich panel KYORAKU CO LTD 2011-09-28 CN disclosed
US-20110101561-A1 METHOD FOR FORMING RESIN MOLDED ARTICLES KYORAKU CO., LTD. (JP) 2011-05-05 US disclosed
US-4517395-A CARBON MONOXIDE CHEMISCHE WERKE HULS AKTIENGESELLSCHAFT (DE) 1985-05-14 US disclosed