SCHEMBL1885293

SCHEMBL1885293

[Cu].[Cu].[Zn]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27532634 1.00
SCHEMBL76621 1.00
SCHEMBL3806039 1.00 GSK3B (0.50)
SCHEMBL11875275 1.00 GSK3B (0.50)
SCHEMBL1191855 1.00
SCHEMBL10583268 0.82
SCHEMBL9144311 0.82
Fluoride SCHEMBL11311528 0.82
SCHEMBL20590920 0.82
SCHEMBL20446652 0.82

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117102241-A Heterogeneous lamellar copper-copper zinc alloy with friction anisotropy and preparation method thereof 南京理工大学 2023-11-24 CN claimed
CN-114664497-A Modified silver nanowire dispersion liquid, preparation method thereof and preparation method of transparent conductive electrode 北京化工大学 2022-06-24 CN claimed
CN-117102241-B Heterogeneous lamellar copper-copper zinc alloy with friction anisotropy and preparation method thereof 南京理工大学 2026-02-24 CN disclosed
CN-117102241-B Heterogeneous lamellar copper-copper zinc alloy with friction anisotropy and preparation method thereof 南京理工大学 2026-02-24 CN disclosed
CN-119387311-A Tin zinc copper alloy sheet material is extended and is pressed processingequipment 江西科美格新材料有限公司 2025-02-07 CN disclosed
CN-119331504-A Application of purified and modified thorium element in SPC (copper-zinc-copper) plate UV (ultraviolet) liquid 河北胜远建设工程有限公司 2025-01-21 CN disclosed
CN-119331504-A Application of purified and modified thorium element in SPC (copper-zinc-copper) plate UV (ultraviolet) liquid 河北胜远建设工程有限公司 2025-01-21 CN disclosed
CN-118326464-A Method for preparing high corrosion resistance Ni-Cu-Zn composite coating on high strength steel surface 宝山钢铁股份有限公司 2024-07-12 CN disclosed
CN-117102241-A Heterogeneous lamellar copper-copper zinc alloy with friction anisotropy and preparation method thereof 南京理工大学 2023-11-24 CN disclosed
CN-117102241-A Heterogeneous lamellar copper-copper zinc alloy with friction anisotropy and preparation method thereof 南京理工大学 2023-11-24 CN disclosed
CN-117102241-A Heterogeneous lamellar copper-copper zinc alloy with friction anisotropy and preparation method thereof 南京理工大学 2023-11-24 CN disclosed
CN-114664497-A Modified silver nanowire dispersion liquid, preparation method thereof and preparation method of transparent conductive electrode 北京化工大学 2022-06-24 CN disclosed
CN-105834533-B Wire electrode for slow wire feeding spark cutting 宁波博德高科股份有限公司 2017-12-01 CN disclosed
CN-106311247-A Method for preparing catalyst used for methanol synthesis 中国石油化工股份有限公司 2017-01-11 CN disclosed
CN-105925871-A Special composite metal plate material for automobile parts and preparation method thereof 安徽越天特种车桥有限公司 2016-09-07 CN disclosed
CN-105834533-A Electrode wire used for spark cutting of low-speed wire cutting and preparation method of electrode wire 宁波博威麦特莱科技有限公司 2016-08-10 CN disclosed
US-20110207964-A1 PROCESS FOR PRODUCING NITROGEN-CONTAINING COMPOUNDS KAO CORPORATION (JP) 2011-08-25 US disclosed
US-7935846-B2 Method of producing nitrogen-containing compound KAO CORPORATION (JP) 2011-05-03 US disclosed
CN-1121513-C Non-cyanide copper-zinc electroplating bath, method of surface treatment of copper foil for printed wiring board using the same and copper foil for printed wiring board NIPPON DENKAI LTD (JP) 2003-09-17 CN disclosed
CN-1111685-A Non-cyanide copper-zinc electroplating bath, method of surface treatment of copper foil for printed wiring board using the same and copper foil for printed wiring board NIPPON DENKAI LTD (JP) 1995-11-15 CN disclosed