SCHEMBL1901556

SCHEMBL1901556

F/C=C(\F)C(F)=C(F)F

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1218994 1.00
SCHEMBL29188768 0.96
Butadiene SCHEMBL10338103 0.87
SCHEMBL14890997 0.74
SCHEMBL14890996 0.74
SCHEMBL8624892 0.69
SCHEMBL14891775 0.67
SCHEMBL2868041 0.67
SCHEMBL18807499 0.67
SCHEMBL2868040 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 36 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-106233436-B Method for increasing etching rate of silicon etching process by etching chamber pretreatment 国际商业机器公司 2020-01-07 CN disclosed
US-9711365-B2 Etch rate enhancement for a silicon etch process through etch chamber pretreatment INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2017-07-18 US disclosed
US-20150318182-A1 ETCH RATE ENHANCEMENT FOR A SILICON ETCH PROCESS THROUH ETCH CHAMBER PRETREATMENT ZEON CORPORATION (JP) 2015-11-05 US disclosed
US-8928124-B2 High aspect ratio and reduced undercut trench etch process for a semiconductor substrate INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2015-01-06 US disclosed
US-8652969-B2 High aspect ratio and reduced undercut trench etch process for a semiconductor substrate INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2014-02-18 US disclosed
US-20130328173-A1 HIGH ASPECT RATIO AND REDUCED UNDERCUT TRENCH ETCH PROCESS FOR A SEMICONDUCTOR SUBSTRATE ZEON CORPORATION (JP) 2013-12-12 US disclosed
US-8535551-B2 Plasma etching method ZEON CORPORATION (JP) 2013-09-17 US disclosed
US-20130105947-A1 HIGH ASPECT RATIO AND REDUCED UNDERCUT TRENCH ETCH PROCESS FOR A SEMICONDUCTOR SUBSTRATE ZEON CORPORATION (JP) 2013-05-02 US disclosed
US-8404906-B2 Process for producing 1,2,3,4-tetrachlorohexafluorobutane SHOWA DENKO K.K. (JP) 2013-03-26 US disclosed
US-20110112341-A1 PROCESS FOR PRODUCING 1,2,3,4-TETRACHLOROHEXAFLUOROBUTANE SHOWADENKO K.K. (JP) 2011-05-12 US disclosed
EP-0190993-A2 Perfluoroalkylsulfonoalkyl acrylates and methacrylates, process for their preparation and their use CIBA-GEIGY AG (CH) 1986-08-13 EP disclosed
EP-0181281-A1 Fluoroalkylcarbamyl acrylates and methacrylates CIBA-GEIGY AG (CH) 1986-05-14 EP disclosed
EP-0177447-A1 Diperfluoroalkyl carbamyl acrylates and methacrylates CIBA-GEIGY AG (CH) 1986-04-09 EP disclosed
EP-0083312-B1 AQUEOUS BASED FIRE FOAM COMPOSITIONS CONTAINING HYDROCARBYL SULFIDE TERMINATED OLIGOMER STABILIZERS CIBA-GEIGY AG (CH) 1986-03-05 EP disclosed
EP-0019584-B1 OLIGOMERS WITH PERFLUOR ALKYL END GROUPS THAT CONTAIN MERCAPTO GROUPS, PROCESS FOR THEIR PREPARATION AND THEIR USE AS SUFACE-ACTIVE SUBSTANCES AND AS ADDITIVES IN FIRE-EXTINGUISHING COMPOSITIONS CIBA-GEIGY AG (CH) 1984-11-14 EP disclosed
EP-0115253-A1 Perfluoroalkyl substituted polymers CIBA-GEIGY AG (CH) 1984-08-08 EP disclosed
US-4460480-A Protein hydrolyzate compositions for fire fighting containing perfluoroalkyl sulfide terminated oligomers CIBA-GEIGY CORPORATION (US) 1984-07-17 US disclosed
US-4439329-A Aqueous based fire fighting foam compositions containing hydrocarbyl sulfide terminated oligomer stabilizers CIBA-GEIGY CORPORATION (US) 1984-03-27 US disclosed
EP-0083312-A1 Aqueous based fire foam compositions containing hydrocarbyl sulfide terminated oligomer stabilizers CIBA-GEIGY AG (CH) 1983-07-06 EP disclosed
EP-0019584-A2 Oligomers with perfluor alkyl end groups that contain mercapto groups, process for their preparation and their use as suface-active substances and as additives in fire-extinguishing compositions CIBA-GEIGY AG (CH) 1980-11-26 EP disclosed