⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4516972 | 0.91 | — | — | |
| SCHEMBL4524681 | 0.91 | — | — | |
| SCHEMBL4516550 | 0.91 | — | — | |
| SCHEMBL4526558 | 0.91 | — | — | |
| SCHEMBL4523608 | 0.91 | — | — | |
| SCHEMBL4531896 | 0.91 | — | — | |
| SCHEMBL4531311 | 0.91 | — | — | |
| SCHEMBL4534991 | 0.91 | — | — | |
| SCHEMBL4526249 | 0.91 | — | — | |
| SCHEMBL4526499 | 0.91 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 286 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8039071-B2 | Gas barrier layered product and packaging medium, and method for producing gas barrier layered product | KURARAY CO., LTD. (JP) | 2011-10-18 | — | — | US | claimed |
| US-20100209639-A1 | GAS BARRIER LAYERED PRODUCT AND PACKAGING MEDIUM, AND METHOD FOR PRODUCING GAS BARRIER LAYERED PRODUCT | KURARAY CO. LTD. (JP) | 2010-08-19 | — | — | US | claimed |
| CN-115989202-B | Polyarylene sulfide resin composition, molded article, and method for producing same | DIC株式会社 | 2025-05-27 | — | — | CN | disclosed |
| CN-119998100-A | Forced demolding molded article, polyarylene sulfide resin composition, and method for producing forced demolding molded article | DIC株式会社 | 2025-05-13 | — | — | CN | disclosed |
| CN-119948110-A | Polyarylene sulfide resin composition, molded article, and method for producing same | DIC株式会社 | 2025-05-06 | — | — | CN | disclosed |
| CN-119753576-A | Flexible copper-clad laminate and electronic device | DIC株式会社 | 2025-04-04 | — | — | CN | disclosed |
| CN-119383831-A | High-frequency hybrid substrate, millimeter wave radar, and antenna | DIC株式会社 | 2025-01-28 | — | — | CN | disclosed |
| CN-119233949-A | Copper-chromium oxide spinel, resin composition thereof, resin molded article, and method for producing copper-chromium oxide spinel | DIC株式会社 | 2024-12-31 | — | — | CN | disclosed |
| CN-119233529-A | Circuit board and high-speed transmission cable | DIC株式会社 | 2024-12-31 | — | — | CN | disclosed |
| CN-119173705-A | Gear, worm gear and robot | DIC株式会社 | 2024-12-20 | — | — | CN | disclosed |
| CN-119173481-A | Copper oxide chromium spinel, resin composition thereof, and resin molded article | DIC株式会社 | 2024-12-20 | — | — | CN | disclosed |
| US-6121388-A | A MOLDING MATERIAL OF POLYAMIDE RESIN, A LIQUID-CRYSTALLINE RESIN, AND AN ACID ANHYDRIDE SELECTED FROM SUCCINIC, NAPHTHALIC OR PHTHALIC ANHYDRIDE; BOX-TYPE MOLDINGS WITH THIN-WALL PARTS; GOOD FLUIDITY IN MOLD AND MOLDABLITY; | TORAY INDUSTRIES, INC. (JP) | 2000-09-19 | — | — | US | disclosed |
| EP-1033388-A1 | THERMOPLASTIC RESIN COMPOSITION | KUREHA KAGAKU KOGYO KABUSHIKI KAISHA (JP) | 2000-09-06 | — | — | EP | disclosed |
| EP-1022314-A1 | POLYAMIDE RESIN COMPOSITION AND PROCESS FOR PRODUCING THE SAME | TORAY INDUSTRIES, INC. (JP) | 2000-07-26 | — | — | EP | disclosed |
| EP-0957132-A1 | Polyamide resin composition | TORAY INDUSTRIES, INC. (JP) | 1999-11-17 | — | — | EP | disclosed |
| CN-1205020-A | Polyphenylene sulfide resin composition | TORAY INDUSTRIES (JP) | 1999-01-13 | — | — | CN | disclosed |
| EP-0888880-A1 | CONDUCTIVE MULTILAYER BLOW MOLDING AND CONDUCTIVE RESIN COMPOSITION | TORAY INDUSTRIES, INC. (JP) | 1999-01-07 | — | — | EP | disclosed |
| EP-0852249-A1 | POLYPHENYLENE SULFIDE RESIN COMPOSITION | TORAY INDUSTRIES, INC. (JP) | 1998-07-08 | — | — | EP | disclosed |
| US-4697009-A | N-silylpropyl-N'-acyl-ureas and process for their production | DEGUSSA AKTIENGESELLSCHAFT (DE) | 1987-09-29 | — | — | US | disclosed |
| US-4097511-A | Organofunctional-silicon materials | GENERAL ELECTRIC COMPANY (US) | 1978-06-27 | — | — | US | disclosed |