SCHEMBL19124642

SCHEMBL19124642

CCO[Si](C)(CCCCCCCCC1CCC2OC2C1)OCC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17766126 1.00
SCHEMBL17766115 1.00
SCHEMBL17766139 0.98 PTGS1 (0.30)
SCHEMBL10927463 0.94 PTGS1 (0.30)
SCHEMBL17766098 0.89
SCHEMBL17766102 0.89
SCHEMBL17766165 0.88
SCHEMBL17766128 0.88
SCHEMBL17766101 0.88
SCHEMBL17766131 0.88

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 36 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3312211-B1 CURABLE COMPOSITION, ADHESIVE SHEET, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING ADHESIVE SHEET, AND DEVICE DAICEL CORP (JP) 2026-05-27 EP disclosed
US-12319815-B2 Resin composition, method for producing same, and multi-liquid curable resin composition KANEKA CORPORATION (JP) 2025-06-03 US disclosed
US-12312494-B2 Resin composition, method for producing same, and multi-liquid curable resin composition KANEKA CORPORATION (JP) 2025-05-27 US disclosed
EP-3626795-B1 CURABLE COMPOSITION FOR ADHESIVE AGENTS, ADHESIVE SHEET, CURED ARTICLE, LAMINATE, AND DEVICE DAICEL CORP (JP) 2024-10-02 EP disclosed
US-12091588-B2 Curable composition for adhesive agents, adhesive sheet, cured article, laminate, and device DAICEL CORPORATION (JP) 2024-09-17 US disclosed
CN-115003759-B Resin composition, method for producing same, and multicomponent curable resin composition 株式会社钟化 2023-12-01 CN disclosed
CN-116917368-A Curable resin composition and use thereof 株式会社钟化 2023-10-20 CN disclosed
CN-114008113-B Resin composition, method for producing same, and multicomponent curable resin composition 株式会社钟化 2023-05-02 CN disclosed
US-20220340777-A1 RESIN COMPOSITION, METHOD FOR PRODUCING SAME, AND MULTI-LIQUID CURABLE RESIN COMPOSITION KANEKA CORPORATION (JP) 2022-10-27 US disclosed
WO-2022202173-A1 CURABLE RESIN COMPOSITION AND USE THEREOF 株式会社カネカ 2022-09-29 WO disclosed
CN-110637074-A Curable composition for adhesive, adhesive sheet, cured product, laminate, and device 株式会社大赛璐 2019-12-31 CN disclosed
CN-107001583-B Photocurable and thermosetting resin composition, cured product, and laminate 株式会社钟化 2019-06-18 CN disclosed
US-20180171193-A1 CURABLE COMPOSITION, ADHESIVE SHEET, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING ADHESIVE SHEET, AND DEVICE DAICEL CORPORATION (JP) 2018-06-21 US disclosed
EP-3312211-A1 CURABLE COMPOSITION, ADHESIVE SHEET, CURED PRODUCT, LAMINATE, PRODUCTION METHOD FOR ADHESIVE SHEET, AND DEVICE Daicel Corporation (JP) 2018-04-25 EP disclosed
CN-107683299-A Solidification compound, adhesive sheet, solidfied material, laminate, the manufacture method of adhesive sheet and device 株式会社大赛璐 2018-02-09 CN disclosed
EP-3235845-A1 PHOTOCURABLE AND THERMOSETTING RESIN COMPOSITION, CURED PRODUCT AND LAMINATE Kaneka Corporation (JP) 2017-10-25 EP disclosed
US-20170283649-A1 PHOTOCURABLE AND THERMOSETTING RESIN COMPOSITION, CURED PRODUCT, AND LAMINATE KANEKA CORPORATION (JP) 2017-10-05 US disclosed
EP-3202811-A1 ACTINIC RADIATION CURABLE COMPOSITION Kaneka Corporation (JP) 2017-08-09 EP disclosed
CN-107001583-A Photocurable and thermosetting resin composition, cured product, and laminate 株式会社钟化 2017-08-01 CN disclosed
US-20170204231-A1 ACTINIC RADIATION CURABLE COMPOSITION KANEKA CORPORATION (JP) 2017-07-20 US disclosed