Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL17766116 | 1.00 | PTGS1 (0.30) | PTGS1PTGS2 | |
| SCHEMBL19124411 | 1.00 | PTGS1 (0.30) | PTGS1PTGS2 | |
| SCHEMBL17766142 | 1.00 | PTGS1 (0.30) | PTGS1PTGS2 | |
| SCHEMBL12098742 | 0.98 | PTGS1 (0.30) | PTGS1PTGS2 | |
| SCHEMBL465200 | 0.94 | PTGS1 (0.31) | PTGS1PTGS2 | |
| SCHEMBL17766103 | 0.90 | — | — | |
| SCHEMBL17766106 | 0.90 | — | — | |
| SCHEMBL17766167 | 0.88 | PPM1B (0.30) | — | |
| SCHEMBL612720 | 0.87 | PTGS1 (0.32) | PTGS1PTGS2 | |
| SCHEMBL17766111 | 0.86 | PTGS1 (0.33) | PTGS1PTGS2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 31 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3312211-B1 | CURABLE COMPOSITION, ADHESIVE SHEET, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING ADHESIVE SHEET, AND DEVICE | DAICEL CORP (JP) | 2026-05-27 | — | — | EP | disclosed |
| US-12319815-B2 | Resin composition, method for producing same, and multi-liquid curable resin composition | KANEKA CORPORATION (JP) | 2025-06-03 | — | — | US | disclosed |
| US-12312494-B2 | Resin composition, method for producing same, and multi-liquid curable resin composition | KANEKA CORPORATION (JP) | 2025-05-27 | — | — | US | disclosed |
| EP-3626795-B1 | CURABLE COMPOSITION FOR ADHESIVE AGENTS, ADHESIVE SHEET, CURED ARTICLE, LAMINATE, AND DEVICE | DAICEL CORP (JP) | 2024-10-02 | — | — | EP | disclosed |
| US-12091588-B2 | Curable composition for adhesive agents, adhesive sheet, cured article, laminate, and device | DAICEL CORPORATION (JP) | 2024-09-17 | — | — | US | disclosed |
| CN-115003759-B | Resin composition, method for producing same, and multicomponent curable resin composition | 株式会社钟化 | 2023-12-01 | — | — | CN | disclosed |
| CN-116917368-A | Curable resin composition and use thereof | 株式会社钟化 | 2023-10-20 | — | — | CN | disclosed |
| CN-114008113-B | Resin composition, method for producing same, and multicomponent curable resin composition | 株式会社钟化 | 2023-05-02 | — | — | CN | disclosed |
| US-20220340777-A1 | RESIN COMPOSITION, METHOD FOR PRODUCING SAME, AND MULTI-LIQUID CURABLE RESIN COMPOSITION | KANEKA CORPORATION (JP) | 2022-10-27 | — | — | US | disclosed |
| WO-2022202173-A1 | CURABLE RESIN COMPOSITION AND USE THEREOF | 株式会社カネカ | 2022-09-29 | — | — | WO | disclosed |
| EP-3626795-A1 | CURABLE COMPOSITION FOR ADHESIVE AGENT, ADHESIVE SHEET, CURED ARTICLE, LAMINATE, AND APPARATUS | Daicel Corporation (JP) | 2020-03-25 | — | — | EP | disclosed |
| US-10563088-B2 | Photocurable and thermosetting resin composition, cured product, and laminate | KANEKA CORPORATION (JP) | 2020-02-18 | — | — | US | disclosed |
| CN-110651336-A | Conductive paste composition, device including electrode formed from conductive paste composition, and method for producing conductive paste composition | 株式会社钟化 | 2020-01-03 | — | — | CN | disclosed |
| CN-110637074-A | Curable composition for adhesive, adhesive sheet, cured product, laminate, and device | 株式会社大赛璐 | 2019-12-31 | — | — | CN | disclosed |
| US-20180171193-A1 | CURABLE COMPOSITION, ADHESIVE SHEET, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING ADHESIVE SHEET, AND DEVICE | DAICEL CORPORATION (JP) | 2018-06-21 | — | — | US | disclosed |
| EP-3312211-A1 | CURABLE COMPOSITION, ADHESIVE SHEET, CURED PRODUCT, LAMINATE, PRODUCTION METHOD FOR ADHESIVE SHEET, AND DEVICE | Daicel Corporation (JP) | 2018-04-25 | — | — | EP | disclosed |
| EP-3235845-A1 | PHOTOCURABLE AND THERMOSETTING RESIN COMPOSITION, CURED PRODUCT AND LAMINATE | Kaneka Corporation (JP) | 2017-10-25 | — | — | EP | disclosed |
| US-20170283649-A1 | PHOTOCURABLE AND THERMOSETTING RESIN COMPOSITION, CURED PRODUCT, AND LAMINATE | KANEKA CORPORATION (JP) | 2017-10-05 | — | — | US | disclosed |
| EP-3202811-A1 | ACTINIC RADIATION CURABLE COMPOSITION | Kaneka Corporation (JP) | 2017-08-09 | — | — | EP | disclosed |
| US-20170204231-A1 | ACTINIC RADIATION CURABLE COMPOSITION | KANEKA CORPORATION (JP) | 2017-07-20 | — | — | US | disclosed |