SCHEMBL1934036

SCHEMBL1934036

[Cu].[Cu].[Si]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28186378 1.00
SCHEMBL8379017 1.00
SCHEMBL28289634 1.00
SCHEMBL8379009 1.00
SCHEMBL221228 1.00
SCHEMBL221229 1.00
SCHEMBL1934035 1.00
SCHEMBL29550663 1.00
SCHEMBL8379010 1.00
SCHEMBL23346293 0.82

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20220077142-A1 Method of Packaging a Rectifying Device and a Rectifying Device ROBERT BOSCH (AUSTRALIA) PTY. LTD. (AU) 2022-03-10 US disclosed
CN-111035807-B Preparation method of ultrathin APCS (amorphous silicon copper-zinc copper) implant 华中科技大学同济医学院附属协和医院 2022-02-11 CN disclosed
WO-2011068470-A1 AN ENHANCED HEAT SINK NATIONAL UNIVERSITY OF SINGAPORE (SG) 2011-06-09 WO disclosed