⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9418384 | 1.00 | — | — | |
| SCHEMBL6037403 | 1.00 | — | — | |
| SCHEMBL6037428 | 1.00 | — | — | |
| SCHEMBL6037427 | 1.00 | — | — | |
| SCHEMBL614053 | 1.00 | — | — | |
| SCHEMBL37275 | 0.97 | — | — | |
| SCHEMBL10864930 | 0.90 | — | — | |
| SCHEMBL202641 | 0.89 | — | — | |
| SCHEMBL3914929 | 0.84 | — | — | |
| Trimethylammonium SCHEMBL15015633 | 0.82 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12319815-B2 | Resin composition, method for producing same, and multi-liquid curable resin composition | KANEKA CORPORATION (JP) | 2025-06-03 | — | — | US | disclosed |
| US-12312494-B2 | Resin composition, method for producing same, and multi-liquid curable resin composition | KANEKA CORPORATION (JP) | 2025-05-27 | — | — | US | disclosed |
| CN-115003759-B | Resin composition, method for producing same, and multicomponent curable resin composition | 株式会社钟化 | 2023-12-01 | — | — | CN | disclosed |
| CN-116917368-A | Curable resin composition and use thereof | 株式会社钟化 | 2023-10-20 | — | — | CN | disclosed |
| CN-114008113-B | Resin composition, method for producing same, and multicomponent curable resin composition | 株式会社钟化 | 2023-05-02 | — | — | CN | disclosed |
| US-20220340777-A1 | RESIN COMPOSITION, METHOD FOR PRODUCING SAME, AND MULTI-LIQUID CURABLE RESIN COMPOSITION | KANEKA CORPORATION (JP) | 2022-10-27 | — | — | US | disclosed |
| WO-2022202173-A1 | CURABLE RESIN COMPOSITION AND USE THEREOF | 株式会社カネカ | 2022-09-29 | — | — | WO | disclosed |
| CN-115003759-A | Resin composition, method for producing same, and multi-component curable resin composition | 株式会社钟化 | 2022-09-02 | — | — | CN | disclosed |
| CN-110651336-B | Conductive paste composition, electrode device comprising same, and method for producing conductive paste composition | 株式会社钟化 | 2022-05-17 | — | — | CN | disclosed |
| US-20220073747-A1 | RESIN COMPOSITION, METHOD FOR PRODUCING SAME, AND MULTI-LIQUID CURABLE RESIN COMPOSITION | KANEKA CORPORATION (JP) | 2022-03-10 | — | — | US | disclosed |
| CN-114008113-A | Resin composition, method for producing same, and multi-component curable resin composition | 株式会社钟化 | 2022-02-01 | — | — | CN | disclosed |
| WO-2021145064-A1 | RESIN COMPOSITION, METHOD FOR PRODUCING SAME, AND MULTI-COMPONENT CURABLE RESIN COMPOSITION | 株式会社カネカ | 2021-07-22 | — | — | WO | disclosed |
| WO-2020235524-A1 | RESIN COMPOSITION, METHOD FOR PRODUCING SAME, AND MULTI-COMPONENT CURABLE RESIN COMPOSITION | 株式会社カネカ (JP) | 2020-11-26 | — | — | WO | disclosed |
| EP-3235845-B1 | PHOTOCURABLE AND THERMOSETTING RESIN COMPOSITION, CURED PRODUCT AND LAMINATE | KANEKA CORP (JP) | 2020-07-15 | — | — | EP | disclosed |
| US-10563088-B2 | Photocurable and thermosetting resin composition, cured product, and laminate | KANEKA CORPORATION (JP) | 2020-02-18 | — | — | US | disclosed |
| CN-110651336-A | Conductive paste composition, device including electrode formed from conductive paste composition, and method for producing conductive paste composition | 株式会社钟化 | 2020-01-03 | — | — | CN | disclosed |
| EP-3235845-A1 | PHOTOCURABLE AND THERMOSETTING RESIN COMPOSITION, CURED PRODUCT AND LAMINATE | Kaneka Corporation (JP) | 2017-10-25 | — | — | EP | disclosed |
| US-20170283649-A1 | PHOTOCURABLE AND THERMOSETTING RESIN COMPOSITION, CURED PRODUCT, AND LAMINATE | KANEKA CORPORATION (JP) | 2017-10-05 | — | — | US | disclosed |