SCHEMBL19410554

SCHEMBL19410554

C(CCOCCCCOCCCCOCCCCOCC1CO1)COCCCCOCCCCOCCCCOCCCCOCC1CO1

nearest known ligand 0.95

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.95
ALDH1A1 P00352 7/20 0.72
TDP1 Q9NUW8 3/20 0.72
SMN1; SMN2 Q16637 2/20 0.71
MAPK1 P28482 1/20 0.48
MEN1 O00255 1/20 0.40
KMT2A Q03164 1/20 0.40
TP53 P04637 2/20 0.38
CYP3A4 P08684 2/20 0.38
HIF1A Q16665 1/20 0.34
SPHK2 Q9NRA0 3/20 0.33
SPHK1 Q9NYA1 3/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19410598 1.00 TSHR (0.95) TSHRALDH1A1TDP1SMN1; SMN2MAPK1
SCHEMBL19410610 1.00 TSHR (0.95) TSHRALDH1A1TDP1SMN1; SMN2MAPK1
SCHEMBL19410553 1.00 TSHR (0.95) TSHRALDH1A1TDP1SMN1; SMN2MAPK1
SCHEMBL19410602 1.00 TSHR (0.95) TSHRALDH1A1TDP1SMN1; SMN2MAPK1
SCHEMBL19410576 1.00 TSHR (0.95) TSHRALDH1A1TDP1SMN1; SMN2MAPK1
SCHEMBL1351605 1.00 TSHR (0.95) TSHRALDH1A1TDP1SMN1; SMN2MAPK1
SCHEMBL19410551 1.00 TSHR (0.95) TSHRALDH1A1TDP1SMN1; SMN2MAPK1
SCHEMBL13974192 0.97 TSHR (1.00) TSHRALDH1A1TDP1SMN1; SMN2MAPK1
SCHEMBL17549553 0.97 TSHR (1.00) TSHRALDH1A1TDP1SMN1; SMN2MAPK1
SCHEMBL17549551 0.97 TSHR (1.00) TSHRALDH1A1TDP1SMN1; SMN2MAPK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-107077067-B Photosensitive resin composition, photosensitive resin laminate, method for producing resin pattern, cured film, and display device 旭化成株式会社 2021-04-13 CN disclosed
US-10338468-B2 Photosensitive resin composition, photosensitive resin laminate, resin pattern production method, cured film, and display device ASAHI KASEI KABUSHIKI KAISHA (JP) 2019-07-02 US disclosed
US-20170285474-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAMINATE, RESIN PATTERN PRODUCTION METHOD, CURED FILM, AND DISPLAY DEVICE ASAHI KASEI KABUSHIKI KAISHA (JP) 2017-10-05 US disclosed