SCHEMBL194870

SCHEMBL194870

[CH2]C1(C)CO1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL20504484 1.00
SCHEMBL1057976 0.75
SCHEMBL10439984 0.73
SCHEMBL10439997 0.73
SCHEMBL2803148 0.73
Hydrochloric Acid SCHEMBL29078690 0.73
SCHEMBL50056 0.70
SCHEMBL3581756 0.70
SCHEMBL2710428 0.70
SCHEMBL2031403 0.70 EPHX1 (0.32)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 2324 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4378928-A1 NAPHTHALENE DITHIOL AND DERIVATIVE THEREOF, AND PRODUCTION METHODS AND USES FOR SAME SUGAI CHEMICAL INDUSTRY CO., LTD. (JP) 2024-06-05 EP claimed
CN-118055922-A Naphthalene dithiol and its derivatives, and their preparation method and use 菅井化学工业株式会社 2024-05-17 CN claimed
US-11884813-B2 Macromonomer copolymer, epoxy resin composition, adhesive, molding material, and cured product MITSUBISHI CHEMICAL CORPORATION (JP) 2024-01-30 US claimed
WO-2023223927-A1 GLYCIDYL ETHER GROUP-CONTAINING COMPOUND, CURABLE RESIN COMPOSITION, CURED PRODUCT, AND LAMINATE DIC株式会社 2023-11-23 WO claimed
WO-2023223926-A1 GLYCIDYL ETHER GROUP-CONTAINING COMPOUND, CURABLE RESIN COMPOSITION, CURED PRODUCT, AND LAMINATE DIC株式会社 2023-11-23 WO claimed
WO-2023223924-A1 GLYCIDYL ETHER GROUP-CONTAINING COMPOUND, CURABLE RESIN COMPOSITION, CURED OBJECT, AND LAMINATE DIC株式会社 2023-11-23 WO claimed
EP-2714826-B1 COATING SYSTEM SWIMC LLC (US) 2023-11-15 EP claimed
EP-3730531-B1 EPOXY COMPOUND, COMPOSITION, CURED PRODUCT AND LAMINATE DAINIPPON INK & CHEMICALS (JP) 2023-10-04 EP claimed
CN-110959138-B Resist material DIC株式会社 2023-06-30 CN claimed
CN-116068853-A Photosensitive resin composition and display device 三星显示有限公司 2023-05-05 CN claimed
EP-0038635-B1 RESIN COMPOSITION FOR POWDER COATING DAINIPPON INK AND CHEMICALS, INC. (JP) 1985-03-20 EP claimed
EP-0019660-B1 PIGMENTED PRINTING PASTE DAINIPPON INK AND CHEMICALS, INC. (JP) 1983-10-05 EP claimed
US-4272423-A COLORFASTNESS DAINIPPON INK & CHEMICALS INC. (JP) 1981-06-09 US claimed
US-4269947-A AN AROMATIC DICARBOXYLIC ACID-ACYCLIC GLYCOL-BASED POLYESTER MODIFIED BY AN EPOXY-CONTAINING COMPOUND; IMPROVED PROPERTIES; FILMS AND FIBERS TEIJIN LIMITED (JP) 1981-05-26 US claimed
EP-0019660-A1 Pigmented printing paste DAINIPPON INK AND CHEMICALS, INC. (JP) 1980-12-10 EP claimed
US-4196066-A UNSATURATED EPOXIDE TEIJIN LIMITED (JP) 1980-04-01 US claimed
US-4142018-A POLYACRYLATES MITSUI TOATSU CHEMICALS, INC. (JP) 1979-02-27 US claimed
US-4139672-A UNDERVOATING, ELECTROCOATING, INTERMEDIATE COAT CONTAINING METAL FARBOXYLIC ACID MITSUI TOATSU CHEMICALS, INC. (JP) 1979-02-13 US claimed
US-4051194-A Thermosetting resin composition for powder paint comprising of a (I) polymer consisting of β-methylglycidyl (meth)acrylate, styrene, unsaturated dialkyl ester, alkylacrylate and (II) saturated aliphatic dibasic acid DAINIPPON INK AND CHEMICALS, INC. (JA) 1977-09-27 US claimed
US-3945953-A CURING, POLYEPOXIDES, HARDENERS, COATINGS, MOLDED MATERIALS, IMPREGNATIONS CIBA-GEIGY CORPORATION (US) 1976-03-23 US claimed