SCHEMBL195060

SCHEMBL195060

CC(C[O])CC(C)(C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL134615 0.83 TSHR (0.36) —
SCHEMBL5032447 0.77 — —
SCHEMBL1402320 0.77 — —
SCHEMBL9302609 0.73 — —
SCHEMBL28574156 0.73 — —
SCHEMBL23045317 0.71 — —
SCHEMBL3887820 0.71 — —
SCHEMBL15503 0.71 — —
SCHEMBL276000 0.71 — —
SCHEMBL19518913 0.71 — —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 437 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0254588-B1 Imidazo[4,5-b] pyridine compounds, process for preparing same and pharmaceutical compositions containing same TOKYO TANABE COMPANY LIMITED (JP) 1992-01-15 — — EP claimed
US-4808596-A STORAGE STABLE, ANTIULCER AGENTS TOKYO TANABE COMPANY, LTD. (JP) 1989-02-28 — — US claimed
EP-0254588-A1 Imidazo[4,5-b] pyridine compounds, process for preparing same and pharmaceutical compositions containing same TOKYO TANABE COMPANY LIMITED (JP) 1988-01-27 — — EP claimed
EP-4372019-A1 NOVEL (METH)ACRYLAMIDE POLYMER, RESIN COMPOSITION CONTAINING SAME, AND MOLDED BODY THEREOF Nippon Soda Co., Ltd. (JP) 2024-05-22 — — EP disclosed
US-11834390-B2 Adhesive composition NIPPON SODA CO., LTD. (JP) 2023-12-05 — — US disclosed
WO-2023190374-A1 DIPHENYL(METH)ACRYLAMIDE-CONTAINING THERMOSETTING RESIN COMPOSITION AND CURED PRODUCT THEREFROM 日本曹達株式会社 2023-10-05 — — WO disclosed
US-20230142648-A1 OXIME ESTER PHOTOINITIATORS BASF SE (DE) 2023-05-11 — — US disclosed
US-20230120998-A1 ADHESIVE COMPOSITION NIPPON SODA CO., LTD. (JP) 2023-04-20 — — US disclosed
US-20230118487-A1 TWO-COMPONENT ADHESIVE COMPOSITION NIPPON SODA CO., LTD. (JP) 2023-04-20 — — US disclosed
EP-4130166-A1 ADHESIVE COMPOSITION Nippon Soda Co., Ltd. (JP) 2023-02-08 — — EP disclosed
EP-4130179-A1 TWO-COMPONENT ADHESIVE COMPOSITION Nippon Soda Co., Ltd. (JP) 2023-02-08 — — EP disclosed
EP-0670323-A1 Dimeric bisacylphosphines, bisacylphosphine oxides and bisacylphosphine sulfides CIBA-GEIGY AG (CH) 1995-09-06 — — EP disclosed
EP-0656359-A1 Substituted 6,11-ethano-6,11-dihydrobenzo[b]quinolizinium salts and compositionsand methods of use thereof STERLING WINTHROP INC. (US) 1995-06-07 — — EP disclosed
EP-0647641-A1 Substituted heterocyclylisoquinolinium salts and compositions and methods of usethereof STERLING WINTHROP INC. (US) 1995-04-12 — — EP disclosed
US-5399770-A Photoinitiator, preparation of printing plates, curing white paints CIBA-GEIGY CORPORATION (US) 1995-03-21 — — US disclosed
US-5144051-A Improved solubility; photinitiators for epoxy compounds or expoxysilanes MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1992-09-01 — — US disclosed
EP-0254588-B1 Imidazo[4,5-b] pyridine compounds, process for preparing same and pharmaceutical compositions containing same TOKYO TANABE COMPANY LIMITED (JP) 1992-01-15 — — EP disclosed
US-4808596-A STORAGE STABLE, ANTIULCER AGENTS TOKYO TANABE COMPANY, LTD. (JP) 1989-02-28 — — US disclosed
EP-0254588-A1 Imidazo[4,5-b] pyridine compounds, process for preparing same and pharmaceutical compositions containing same TOKYO TANABE COMPANY LIMITED (JP) 1988-01-27 — — EP disclosed
US-4035379-A Process for the production of 2-amino-benzothiazoles LONZA LTD. (CH) 1977-07-12 — — US disclosed
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