SCHEMBL195060

SCHEMBL195060

CC(C[O])CC(C)(C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL134615 0.83 TSHR (0.36)
SCHEMBL5032447 0.77
SCHEMBL1402320 0.77
SCHEMBL9302609 0.73
SCHEMBL28574156 0.73
SCHEMBL23045317 0.71
SCHEMBL3887820 0.71
SCHEMBL276000 0.71
SCHEMBL15503 0.71
SCHEMBL19518913 0.71

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 437 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0254588-B1 Imidazo[4,5-b] pyridine compounds, process for preparing same and pharmaceutical compositions containing same TOKYO TANABE COMPANY LIMITED (JP) 1992-01-15 EP claimed
US-4808596-A STORAGE STABLE, ANTIULCER AGENTS TOKYO TANABE COMPANY, LTD. (JP) 1989-02-28 US claimed
EP-0254588-A1 Imidazo[4,5-b] pyridine compounds, process for preparing same and pharmaceutical compositions containing same TOKYO TANABE COMPANY LIMITED (JP) 1988-01-27 EP claimed
EP-4372019-A1 NOVEL (METH)ACRYLAMIDE POLYMER, RESIN COMPOSITION CONTAINING SAME, AND MOLDED BODY THEREOF Nippon Soda Co., Ltd. (JP) 2024-05-22 EP disclosed
US-11834390-B2 Adhesive composition NIPPON SODA CO., LTD. (JP) 2023-12-05 US disclosed
WO-2023190374-A1 DIPHENYL(METH)ACRYLAMIDE-CONTAINING THERMOSETTING RESIN COMPOSITION AND CURED PRODUCT THEREFROM 日本曹達株式会社 2023-10-05 WO disclosed
US-20230142648-A1 OXIME ESTER PHOTOINITIATORS BASF SE (DE) 2023-05-11 US disclosed
US-20230120998-A1 ADHESIVE COMPOSITION NIPPON SODA CO., LTD. (JP) 2023-04-20 US disclosed
US-20230118487-A1 TWO-COMPONENT ADHESIVE COMPOSITION NIPPON SODA CO., LTD. (JP) 2023-04-20 US disclosed
EP-4130166-A1 ADHESIVE COMPOSITION Nippon Soda Co., Ltd. (JP) 2023-02-08 EP disclosed
EP-4130179-A1 TWO-COMPONENT ADHESIVE COMPOSITION Nippon Soda Co., Ltd. (JP) 2023-02-08 EP disclosed
EP-0670323-A1 Dimeric bisacylphosphines, bisacylphosphine oxides and bisacylphosphine sulfides CIBA-GEIGY AG (CH) 1995-09-06 EP disclosed
EP-0656359-A1 Substituted 6,11-ethano-6,11-dihydrobenzo[b]quinolizinium salts and compositionsand methods of use thereof STERLING WINTHROP INC. (US) 1995-06-07 EP disclosed
EP-0647641-A1 Substituted heterocyclylisoquinolinium salts and compositions and methods of usethereof STERLING WINTHROP INC. (US) 1995-04-12 EP disclosed
US-5399770-A Photoinitiator, preparation of printing plates, curing white paints CIBA-GEIGY CORPORATION (US) 1995-03-21 US disclosed
US-5144051-A Improved solubility; photinitiators for epoxy compounds or expoxysilanes MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1992-09-01 US disclosed
EP-0254588-B1 Imidazo[4,5-b] pyridine compounds, process for preparing same and pharmaceutical compositions containing same TOKYO TANABE COMPANY LIMITED (JP) 1992-01-15 EP disclosed
US-4808596-A STORAGE STABLE, ANTIULCER AGENTS TOKYO TANABE COMPANY, LTD. (JP) 1989-02-28 US disclosed
EP-0254588-A1 Imidazo[4,5-b] pyridine compounds, process for preparing same and pharmaceutical compositions containing same TOKYO TANABE COMPANY LIMITED (JP) 1988-01-27 EP disclosed
US-4035379-A Process for the production of 2-amino-benzothiazoles LONZA LTD. (CH) 1977-07-12 US disclosed