⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL127070 | 1.00 | — | — | |
| SCHEMBL21624982 | 0.98 | — | — | |
| Hydrogen Sulfide SCHEMBL17010766 | 0.98 | — | — | |
| SCHEMBL26006913 | 0.95 | — | — | |
| SCHEMBL331047 | 0.95 | — | — | |
| SCHEMBL15360420 | 0.93 | — | — | |
| SCHEMBL28931193 | 0.93 | — | — | |
| SCHEMBL25422393 | 0.92 | — | — | |
| SCHEMBL170451 | 0.92 | — | — | |
| SCHEMBL23441676 | 0.92 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2017200705-A1 | POLYMER SUBSTRATE FOR FLEXIBLE ELECTRONICS MICROFABRICATION AND METHODS OF USE | ARES Materials, Inc. (US) | 2017-11-23 | — | — | WO | claimed |
| US-20210230351-A1 | POLYMERIZABLE COMPOSITION AND OPTICAL MATERIAL PRODUCED THEREFROM | SK PUCORE CO., LTD. (KR) | 2021-07-29 | — | — | US | disclosed |
| EP-3658609-A1 | COMPOSITIONS AND METHODS OF MAKING A POLYMERIZED COMPOSITION | 3M Innovative Properties Company (US) | 2020-06-03 | — | — | EP | disclosed |
| WO-2019021115-A1 | COMPOSITIONS AND METHODS OF MAKING A POLYMERIZED COMPOSITION | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2019-01-31 | — | — | WO | disclosed |
| WO-2018049431-A1 | SUBSTRATES FOR STRETCHABLE ELECTRONICS AND METHOD OF MANUFACTURE | ARES MATERIALS INC. (US) | 2018-03-15 | — | — | WO | disclosed |
| WO-2017200705-A1 | POLYMER SUBSTRATE FOR FLEXIBLE ELECTRONICS MICROFABRICATION AND METHODS OF USE | ARES Materials, Inc. (US) | 2017-11-23 | — | — | WO | disclosed |