⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8399998 | 0.87 | — | — | |
| SCHEMBL3789060 | 0.87 | — | — | |
| SCHEMBL1508941 | 0.87 | — | — | |
| SCHEMBL4697257 | 0.82 | — | — | |
| SCHEMBL901165 | 0.82 | — | — | |
| SCHEMBL21192804 | 0.82 | — | — | |
| SCHEMBL891320 | 0.78 | — | — | |
| SCHEMBL6135446 | 0.67 | — | — | |
| Water SCHEMBL1423426 | 0.67 | — | — | |
| SCHEMBL9003707 | 0.67 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 582 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12484348-B2 | Substrate, method for forming the same, display device and for forming the same | Beijing Boe Technology Development Co., Ltd. (CN) | 2025-11-25 | — | — | US | claimed |
| CN-109216286-B | Semiconductor device with a semiconductor device having a plurality of semiconductor chips | 富士电机株式会社 | 2023-09-19 | — | — | CN | claimed |
| US-20230006107-A1 | SUBSTRATE, METHOD FOR FORMING THE SAME, DISPLAY DEVICE AND FOR FORMING THE SAME | Beijing Boe Technology Development Co., Ltd. (CN) | 2023-01-05 | — | — | US | claimed |
| WO-2022042051-A1 | SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE AND MANUFACTURING METHOD THEREFOR | 京东方科技集团股份有限公司 | 2022-03-03 | — | — | WO | claimed |
| CN-114121868-A | Substrate and manufacturing method thereof, display device and manufacturing method thereof | 京东方科技集团股份有限公司 | 2022-03-01 | — | — | CN | claimed |
| US-11137014-B2 | Conductive fastening system and method for improved EME performance | THE BOEING COMPANY (US) | 2021-10-05 | — | — | US | claimed |
| US-10699994-B2 | Semiconductor device having bonding regions exposed through protective films provided on circuit patterns onto which components are soldered | FUJI ELECTRIC CO., LTD. (JP) | 2020-06-30 | — | — | US | claimed |
| CN-108265318-B | Method and device for preparing flexible battery cathode powder | 上海移宇科技股份有限公司 | 2019-12-20 | — | — | CN | claimed |
| CN-109216286-A | Semiconductor device | 富士电机株式会社 | 2019-01-15 | — | — | CN | claimed |
| US-20190006272-A1 | SEMICONDUCTOR DEVICE | FUJI ELECTRIC CO., LTD. (JP) | 2019-01-03 | — | — | US | claimed |
| CN-1738039-A | Semiconductor device and manufacturing method of the same | TOKYO SHIBAURA ELECTRIC CO (JP) | 2006-02-22 | — | — | CN | claimed |
| US-20060033214-A1 | Semiconductor device and manufacturing method of the same | KABUSHIKI KAISHA TOSHIBA | 2006-02-16 | — | — | US | claimed |
| US-20050194695-A1 | Method of assembling chips | QUALCOMM INCORPORATED | 2005-09-08 | — | — | US | claimed |
| EP-1038628-B1 | UNLEADED SOLDER POWDER AND PRODUCTION METHOD THEREFOR | MITSUI MINING & SMELTING CO (JP) | 2005-05-04 | — | — | EP | claimed |
| US-20040126927-A1 | Method of assembling chips | QUALCOMM INCORPORATED | 2004-07-01 | — | — | US | claimed |
| US-20030189260-A1 | FLIP-CHIP BONDING STRUCTURE AND METHOD THEREOF | ADVANCED SEMICONDUCTOR ENGINEERING, INC. (TW) | 2003-10-09 | — | — | US | claimed |
| CN-1105619-C | Unleaded solder powder and production method therefor | MITSUI MINING & SMELTING CO (JP) | 2003-04-16 | — | — | CN | claimed |
| US-6334905-B1 | Unleaded solder powder and production method therefor | MITSUI MINING AND SMELTING COMPANY, LTD. (JP) | 2002-01-01 | — | — | US | claimed |
| CN-1286655-A | Unleaded solder powder and production method therefor | MITSUI MINING & SMELTING CO (JP) | 2001-03-07 | — | — | CN | claimed |
| EP-1038628-A1 | UNLEADED SOLDER POWDER AND PRODUCTION METHOD THEREFOR | Mitsui Mining & Smelting Co., Ltd. (JP) | 2000-09-27 | — | — | EP | claimed |