SCHEMBL1976522

SCHEMBL1976522

C=CC(=O)O/C=C/CCCCCCC

nearest known ligand 0.47

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HPGD P15428 2/20 0.47
TSHR P16473 2/20 0.47
ALDH1A1 P00352 4/20 0.46
KDM4E B2RXH2 3/20 0.46
F7 P08709 3/20 0.46
F3 P13726 3/20 0.46
PPARG P37231 2/20 0.46
PPARD Q03181 2/20 0.46
PPARA Q07869 2/20 0.46
DUSP3 P51452 2/20 0.46
LMNA P02545 2/20 0.46
FABP4 P15090 2/20 0.46
ALOX15 P16050 2/20 0.46
HSD17B10 Q99714 2/20 0.46
PTPN7 P35236 1/20 0.46
FFAR1 O14842 1/20 0.46
FABP3 P05413 1/20 0.46
CYP3A4 P08684 1/20 0.46
CYP19A1 P11511 1/20 0.46
PTGS1 P23219 1/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28457926 1.00 HPGD (0.47) HPGDTSHRALDH1A1KDM4EF7
SCHEMBL1686065 1.00 HPGD (0.47) HPGDTSHRALDH1A1KDM4EF7
SCHEMBL1686087 1.00 HPGD (0.47) HPGDTSHRALDH1A1KDM4EF7
SCHEMBL1686066 1.00 HPGD (0.47) HPGDTSHRALDH1A1KDM4EF7
SCHEMBL14973588 1.00 HPGD (0.47) HPGDTSHRALDH1A1KDM4EF7
SCHEMBL341956 1.00 HPGD (0.47) HPGDTSHRALDH1A1KDM4EF7
SCHEMBL1976525 1.00 HPGD (0.47) HPGDTSHRALDH1A1KDM4EF7
SCHEMBL1972618 1.00 HPGD (0.47) HPGDTSHRALDH1A1KDM4EF7
SCHEMBL1972619 1.00 HPGD (0.47) HPGDTSHRALDH1A1KDM4EF7
SCHEMBL28583401 1.00 HPGD (0.47) HPGDTSHRALDH1A1KDM4EF7

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2083032-B1 POLYMERIZABLE COMPOSITION, CROSSLINKABLE RESIN, AND MANUFACTURE METHODS AND APPLICATIONS THEREOF ZEON CORP (JP) 2014-02-12 EP disclosed
US-8080623-B2 Polymerizable composition, crosslinkable resin, and manufacture methods and applications thereof ZEON CORPORATION (JP) 2011-12-20 US disclosed
US-20110144292-A1 POLYMERIZABLE COMPOSITION, CROSSLINKABLE RESIN, AND MANUFACTURE METHODS AND APPLICATIONS THEREOF ZEON CORPORATION (JP) 2011-06-16 US disclosed
US-20100252310-A1 COMPOSITE FOR MULTILAYER CIRCUIT BOARD KOJIMA KIYOSHIGE 2010-10-07 US disclosed
US-20100124615-A1 Process for Producing Crosslinkable Resin Formed Product ZEON CORPORATION (JP) 2010-05-20 US disclosed
EP-2175706-A1 COMPOSITE FOR MULTILAYER CIRCUIT BOARD ZEON CORPORATION (JP) 2010-04-14 EP disclosed
US-20090305018-A1 Crosslinkable-Resin Formed Product, Crosslinked-Resin Formed Product, and Crosslinked Resin-Metal Clad Laminate ZEON CORPORATION (JP) 2009-12-10 US disclosed
EP-2083032-A1 POLYMERIZABLE COMPOSITION, CROSSLINKABLE RESIN, PROCESS FOR PRODUCTION THEREOF, AND USE THEREOF ZEON CORPORATION (JP) 2009-07-29 EP disclosed
EP-2017304-A1 PROCESS FOR PRODUCING CROSSLINKABLE RESIN MOLDING ZEON CORPORATION (JP) 2009-01-21 EP disclosed
EP-1990364-A1 MOLDED CROSSLINKABLE-RESIN OBJECT, MOLDED CROSSLINKED-RESIN OBJECT, AND CROSSLINKED-RESIN/METAL LAMINATE ZEON CORPORATION (JP) 2008-11-12 EP disclosed