⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL21925062 | 1.00 | — | — | |
| SCHEMBL203233 | 0.74 | — | — | |
| SCHEMBL702310 | 0.71 | — | — | |
| SCHEMBL8652417 | 0.71 | — | — | |
| SCHEMBL5690824 | 0.71 | — | — | |
| SCHEMBL5690823 | 0.71 | — | — | |
| SCHEMBL702309 | 0.71 | — | — | |
| SCHEMBL203193 | 0.65 | — | — | |
| SCHEMBL5690709 | 0.65 | — | — | |
| SCHEMBL5690713 | 0.65 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4530009-A1 | FLUX, SOLDER PASTE, AND METHOD FOR PRODUCING BONDED STRUCTURE | Koki Company Limited (JP) | 2025-04-02 | — | — | EP | disclosed |
| WO-2025032800-A1 | FLUX, SOLDER PASTE, AND METHOD FOR PRODUCING BONDED STRUCTURE | 株式会社弘輝 | 2025-02-13 | — | — | WO | disclosed |
| WO-2024062951-A1 | FLUX AND SOLDER PASTE | 株式会社弘輝 | 2024-03-28 | — | — | WO | disclosed |
| CN-115023314-B | Soldering flux and soldering paste | 株式会社弘辉 | 2024-02-20 | — | — | CN | disclosed |
| EP-3650164-B1 | FLUX AND SOLDERING MATERIAL | KOKI KK (JP) | 2022-11-02 | — | — | EP | disclosed |
| CN-115023314-A | Flux and solder paste | 株式会社弘辉 | 2022-09-06 | — | — | CN | disclosed |
| CN-113766992-B | Flux and solder paste | 株式会社弘辉 | 2022-06-10 | — | — | CN | disclosed |
| WO-2022065389-A1 | FLUX AND SOLDER PASTE | 株式会社弘輝 | 2022-03-31 | — | — | WO | disclosed |
| CN-113766992-A | Flux and solder paste | 株式会社弘辉 | 2021-12-07 | — | — | CN | disclosed |
| CN-109429491-B | Flux and solder material | 株式会社弘辉 | 2021-07-27 | — | — | CN | disclosed |
| US-10864606-B2 | Flux and solder material | KOKI COMPANY LIMITED (JP) | 2020-12-15 | — | — | US | disclosed |
| US-20200269362-A1 | Flux and Solder Material | KOKI COMPANY LIMITED (JP) | 2020-08-27 | — | — | US | disclosed |
| EP-3650164-A1 | FLUX AND SOLDERING MATERIAL | Koki Company Limited (JP) | 2020-05-13 | — | — | EP | disclosed |
| US-20180015576-A1 | Flux Activator, Flux, and Solder | KOKI COMPANY LIMITED (JP) | 2018-01-18 | — | — | US | disclosed |