SCHEMBL19856513

SCHEMBL19856513

CC=CCP(C(C)(C)C)C(C)(C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17287590 0.81 CNR1 (0.30)
SCHEMBL17287477 0.79
SCHEMBL17287534 0.74
SCHEMBL17287641 0.74
SCHEMBL17287737 0.74
SCHEMBL17287837 0.72
SCHEMBL17287540 0.70
SCHEMBL17287473 0.69
SCHEMBL17287799 0.67
SCHEMBL7036699 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 164 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20200385361-A1 METHOD FOR PRODUCING 2-SUBSTITUTED-3-ETHYLSULFONYLPYRIDINE COMPOUND AND LIKE SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2020-12-10 US claimed
EP-3722289-A1 METHOD FOR PRODUCING 2-SUBSTITUTED-3-ETHYLSULFONYL PYRIDINE COMPOUND AND LIKE Sumitomo Chemical Company Limited (JP) 2020-10-14 EP claimed
EP-3892611-B1 METHOD FOR PRODUCING FLUOROVINYL AMIDE COMPOUND DAIKIN IND LTD (JP) 2026-01-28 EP disclosed
EP-4679461-A2 RESIN COMPOSITION AND PRODUCTION METHOD OF THE SAME AJINOMOTO CO., INC. (JP) 2026-01-14 EP disclosed
EP-4586285-A1 RESIN COMPOSITION AJINOMOTO CO., INC. (JP) 2025-07-16 EP disclosed
US-20250214936-A1 METHOD FOR PRODUCING FLUOROVINYL AMIDE COMPOUND DAIKIN INDUSTRIES, LTD. (JP) 2025-07-03 US disclosed
CN-120192630-A Resin composition 味之素株式会社 2025-06-24 CN disclosed
EP-4567840-A1 RESIN COMPOSITION Ajinomoto Co., Inc. (JP) 2025-06-11 EP disclosed
CN-120118471-A Resin composition 味之素株式会社 2025-06-10 CN disclosed
CN-112500622-B Resin composition 味之素株式会社 2025-05-23 CN disclosed
CN-120021354-A Method for manufacturing circuit board 味之素株式会社 2025-05-20 CN disclosed
US-10730992-B2 Curable composition, adhesive, article having coating layer, fiber-reinforced composite material and curable composition kit MITSUBISHI CHEMICAL CORPORATION (JP) 2020-08-04 US disclosed
WO-2020116589-A1 METHOD FOR PRODUCING FLUOROVINYL AMIDE COMPOUND ダイキン工業株式会社 2020-06-11 WO disclosed
EP-3489274-A1 POLYMER COMPOUND PRODUCTION METHOD Sumitomo Chemical Company Limited (JP) 2019-05-29 EP disclosed
US-10266476-B2 (Meth)acrylate manufacturing method TOAGOSEI CO., LTD. (JP) 2019-04-23 US disclosed
US-20180244835-A1 CURABLE COMPOSITION, ADHESIVE, ARTICLE HAVING COATING LAYER, FIBER-REINFORCED COMPOSITE MATERIAL, POTTING AGENT AND CURABLE COMPOSITION KIT MITSUBISHI CHEMICAL CORPORATION (JP) 2018-08-30 US disclosed
US-20180237629-A1 CURABLE COMPOSITION TOAGOSEI CO., LTD. (JP) 2018-08-23 US disclosed
US-20180237576-A1 CURABLE COMPOSITION, ADHESIVE, ARTICLE HAVING COATING LAYER, FIBER-REINFORCED COMPOSITE MATERIAL AND CURABLE COMPOSITION KIT MITSUBISHI CHEMICAL CORPORATION (JP) 2018-08-23 US disclosed
US-20180118658-A1 (METH)ACRYLATE MANUFACTURING METHOD TOAGOSEI CO., LTD. (JP) 2018-05-03 US disclosed
EP-3281933-A1 (METH)ACRYLATE MANUFACTURING METHOD Toagosei Co., Ltd. (JP) 2018-02-14 EP disclosed