Ammonia Solution, Strong

Ammonia Solution, Strong

SCHEMBL199579

CCC(CC)NC.N

nearest known ligand 0.00

Full drug profile on Sugi Atlas →

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL384098 0.96
Hydrochloric Acid SCHEMBL19086841 0.92
SCHEMBL19445841 0.81 SLC6A4 (0.37)
SCHEMBL1195500 0.76
SCHEMBL17212683 0.76
SCHEMBL2758663 0.76
SCHEMBL15714300 0.76
SCHEMBL21105113 0.76
SCHEMBL386419 0.76
SCHEMBL1002020 0.76

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 199 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250019579-A1 COMPOSITION BASED ON (METH)ACRYLATE MONOMERS CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE (FR) 2025-01-16 US claimed
EP-4437056-A1 COMPOSITION BASED ON (METH)ACRYLATE MONOMERS Bostik SA (FR) 2024-10-02 EP claimed
CN-118284673-A Compositions based on (meth) acrylate monomers 博斯蒂克股份公司 2024-07-02 CN claimed
WO-2023089252-A1 COMPOSITION BASED ON (METH)ACRYLATE MONOMERS BOSTIK SA (FR) 2023-05-25 WO claimed
EP-4721970-A1 BONDED STRUCTURE COMPRISING AN ELECTROCHEMICALLY DEBONDABLE ADHESIVE LAYER Henkel AG & Co. KGaA (DE) 2026-04-08 EP disclosed
EP-4721971-A1 METHOD OF SEPARATING BONDED ARTICLES Henkel AG & Co. KGaA (DE) 2026-04-08 EP disclosed
EP-4717746-A1 ONE COMPONENT (1K) COMPOSITION BASED ON EPOXIDE COMPOUNDS Henkel AG & Co. KGaA (DE) 2026-04-01 EP disclosed
US-12590207-B2 Epoxy composition comprising a bio-based epoxy compound HENKEL AG & CO. KGAA (DE) 2026-03-31 US disclosed
US-20260088410-A1 ELECTRONICS ASSEMBLY HAVING ELECTROCHEMICALLY DEBONDABLE COMPONENTS HENKEL AG & CO KGAA (DE) 2026-03-26 US disclosed
EP-4714984-A1 DUAL CURE STRUCTURAL ADHESIVE COMPOSITION Henkel AG & Co. KGaA (DE) 2026-03-25 EP disclosed
US-20260078284-A1 DEBONDABLE ADHESIVE TAPE HENKEL AG & CO KGAA (DE) 2026-03-19 US disclosed
EP-4663713-A1 BONDED STRUCTURE COMPRISING AN THERMALLY DEBONDABLE ADHESIVE FILM Henkel AG & Co. KGaA (DE) 2025-12-17 EP disclosed
US-20100006221-A1 Amorphous polyurethane polymer and its use in hotmelt adhesives SIKA TECHNOLOGY AG (CH) 2010-01-14 US disclosed
US-20100003526-A1 Polyurethane composition with good initial strength SIKA TECHNOLOGY AG (CH) 2010-01-07 US disclosed
US-7629433-B2 Odor-less during hydrolytic deblocking, separation; for use as source for aldehydes; crosslinking agents SIKA TECHNOLOGY AG (CH) 2009-12-08 US disclosed
US-20090176944-A1 Aldimines Comprising Reactive Groups Containing Active Hydrogen, and Use Thereof SIKA TECHNOLOGY AG (CH) 2009-07-09 US disclosed
US-20090159204-A1 Moisture-Hardened Polyurethane Compositions Containing Compounds Comprising Aldimine SIKA TECHNOLOGY AG 2009-06-25 US disclosed
US-20090099333-A1 Compounds Containing Aldimine SIKA TECHNOLOGY AG (CH) 2009-04-16 US disclosed
US-20080280145-A1 moisture-reactive hot-melt adhesive which comprises at least one aldimine and at least one polyurethane polymer ( polyesterurethane copolymer, polyetherurethane copolymer)which contains isocyanate groups and is solid at room temperature; bonded assembly is notable for improved adhesive SIKA TECHNOLOGY AG (CH) 2008-11-13 US disclosed
US-20080251204-A1 Reactive Polyurethane-Hot Melt Adhesive Having a Low Isocyanate-Monomer Content SIKA TECHNOLOGY AG (CH) 2008-10-16 US disclosed