⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL6052979 | 0.75 | — | — | |
| SCHEMBL10585972 | 0.75 | — | — | |
| SCHEMBL7915757 | 0.72 | — | — | |
| SCHEMBL28751435 | 0.71 | — | — | |
| SCHEMBL5786319 | 0.69 | — | — | |
| SCHEMBL8630720 | 0.69 | — | — | |
| SCHEMBL12215033 | 0.69 | — | — | |
| SCHEMBL2666212 | 0.67 | — | — | |
| SCHEMBL189989 | 0.67 | — | — | |
| SCHEMBL3362055 | 0.67 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3504186-A1 | COPPER DEPOSITION IN WAFER LEVEL PACKAGING OF INTEGRATED CIRCUITS | MacDermid Enthone Inc. (US) | 2019-07-03 | — | — | EP | claimed |
| WO-2018057590-A1 | COPPER DEPOSITION IN WAFER LEVEL PACKAGING OF INTEGRATED CIRCUITS | MACDERMID ENTHONE INC. (US) | 2018-03-29 | — | — | WO | claimed |
| US-20240327661-A1 | POLYMER, COPOLYMER, INK, INK CONTAINER, IMAGE FORMING METHOD, IMAGE FORMING DEVICE, AND BACKSHEET FOR SOLAR CELL | RICOH COMPANY, LTD. (JP) | 2024-10-03 | — | — | US | disclosed |
| US-20230242689-A1 | POLYMER, COPOLYMER, INK, INK CONTAINER, IMAGE FORMING METHOD, IMAGE FORMING DEVICE, AND BACKSHEET FOR SOLAR CELL | RICOH COMPANY, LTD. (JP) | 2023-08-03 | — | — | US | disclosed |