SCHEMBL200308

SCHEMBL200308

C[Cu]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8580467 0.87
SCHEMBL25290942 0.87
SCHEMBL568016 0.67
SCHEMBL10869299 0.58
SCHEMBL2196735 0.58
Hydrochloric Acid SCHEMBL277256 0.58
Iodide SCHEMBL392480 0.58
SCHEMBL5383540 0.58
SCHEMBL133545 0.58
SCHEMBL9615101 0.58

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1816 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-120001987-A Preparation method of molybdenum-copper heat sink material 长沙升华微电子材料有限公司 2025-05-16 CN claimed
CN-119979942-A Preparation method of graded porous carbon copper composite material 长沙升华微电子材料有限公司 2025-05-13 CN claimed
CN-119977477-A Green low-carbon copper tailing base alkali-activated concrete and preparation method thereof 桂林理工大学南宁分校 2025-05-13 CN claimed
CN-119926358-A High-specific-surface-area biomass carbon material copper-loaded adsorbent and preparation method and application thereof 浙江工业大学 2025-05-06 CN claimed
CN-115340647-B Double polymer shell/nanoparticle core composite material with light-adjustable heat conductivity coefficient and preparation method thereof 中国地质大学(北京) 2025-04-25 CN claimed
CN-222679126-U Regulating mechanism for wire drawing machine 威海市东沣新材料科技有限公司 2025-03-28 CN claimed
CN-119433221-A Combined treatment process for lead matte, zinc copper slag and carbon copper slag 江西铜业技术研究院有限公司 2025-02-14 CN claimed
CN-119220192-A Nano carbon copper adhesive tape with high soaking property and preparation method thereof 安徽明讯新材料科技股份有限公司 2024-12-31 CN claimed
CN-222226612-U Electroplating bath cathode conductive structure and electroplating equipment with same 保德汇智科技(深圳)有限公司 2024-12-24 CN claimed
CN-119170482-A Atmospheric pressure laser dissociation-secondary electrospray ion source for mass spectrometry of microplastic 湖南大学 2024-12-20 CN claimed
CN-101225534-B Method for preparing polymer-based metal gradient composites UNIV QINGDAO 2010-08-25 CN claimed
CN-101787504-A Preparation method for carbon/carbon-copper composite material UNIV SHANGHAI 2010-07-28 CN claimed
CN-100502168-C Lead welding and shaping method for commutator with carbon copper compound structure HARBIN INST OF TECHNOLOGY (CN) 2009-06-17 CN claimed
CN-101127430-A Lead welding and shaping method for commutator with carbon copper compound structure HARBIN INST OF TECHNOLOGY (CN) 2008-02-20 CN claimed
CN-1418983-A Medium carbon steel and medium carbon alloy steel surface laser melting coating method CHANGCHUDN POLYTECHNIC UNIV (CN) 2003-05-21 CN claimed
US-5260471-A Catalytic reaction of metallic silicon and alkyl alcohol in vapor phase in presence of a halide using copper catalyst TOAGOSEI CHEMICAL INDUSTRY CO., LTD. (JP) 1993-11-09 US claimed
WO-1992013336-A1 ELECTROMAGNETIC TRANSDUCER M HOHNER LIMITED (GB) 1992-08-06 WO claimed
US-4543428-A Production of a hexahydronaphthalenone compound OREGON GRADUATE CENTER FOR STUDY & RESEARCH (US) 1985-09-24 US claimed
US-4515720-A Method of synthesizing a late-stage intermediate to 11-deoxydaunorubicin and 11-deoxyadriamycin, and two precursors to the object intermediate OREGON GRADUATE CENTER FOR STUDY & RESEARCH (US) 1985-05-07 US claimed
US-3971827-A Manufacture of poly-(cis)-isoprenols G. D. SEARLE & CO. (US) 1976-07-27 US claimed