SCHEMBL20127094

SCHEMBL20127094

CN(C)[Si](C)(C)O[Si](C)(C)O[Si](C)(C)N(C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9646071 0.97
SCHEMBL19973284 0.91
SCHEMBL20450723 0.88
SCHEMBL20450738 0.88
SCHEMBL20465773 0.86
SCHEMBL20450729 0.86
SCHEMBL10610805 0.85
SCHEMBL20127095 0.82
SCHEMBL20450724 0.80
SCHEMBL20450740 0.80

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 35 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3516089-B1 COMPOSITIONS AND METHODS FOR THE DEPOSITION OF SILICON OXIDE FILMS VERSUM MAT US LLC (US) 2023-12-20 EP claimed
US-12435416-B2 Compositions and methods using same for non-conformal deposition of silicon containing films VERSUM MATERIALS US, LLC (US) 2025-10-07 US disclosed
US-20250188609-A1 SEAM-FREE AND CRACK-FREE DEPOSITION LAM RES CORP (US) 2025-06-12 US disclosed
CN-114867888-B Method for depositing film 弗萨姆材料美国有限责任公司 2025-05-30 CN disclosed
US-20250054747-A1 CONFORMAL DEPOSITION OF SILICON NITRIDE LAM RES CORP (US) 2025-02-13 US disclosed
US-20250038003-A1 LOW TEMPERATURE MOLYBDENUM DEPOSITION ASSISTED BY SILICON-CONTAINING REACTANTS LAM RESEARCH CORPORATION (US) 2025-01-30 US disclosed
US-20250014890-A1 CONFORMAL, CARBON-DOPED SILICON NITRIDE FILMS AND METHODS THEREOF LAM RESEARCH CORPORATION 2025-01-09 US disclosed
CN-119213529-A Seamless and crack-free deposition 朗姆研究公司 2024-12-27 CN disclosed
WO-2024243002-A1 LOW PRESSURE CHEMICAL VAPOR DEPOSITION OF SILICON OXIDE LAM RESEARCH CORPORATION (US) 2024-11-28 WO disclosed
EP-4449479-A1 LOW TEMPERATURE MOLYBDENUM DEPOSITION ASSISTED BY SILICON-CONTAINING REACTANTS Lam Research Corporation (US) 2024-10-23 EP disclosed
CN-114867888-A Method for depositing a film 弗萨姆材料美国有限责任公司 2022-08-05 CN disclosed
EP-4013903-A1 COMPOSITIONS AND METHODS USING SAME FOR NON-CONFORMAL DEPOSITION OF SILICON-CONTAINING FILMS Versum Materials US, LLC (US) 2022-06-22 EP disclosed
CN-114365265-A Compositions for non-conformal deposition of silicon-containing films and methods of using the same 弗萨姆材料美国有限责任公司 2022-04-15 CN disclosed
WO-2021133774-A1 METHOD FOR DEPOSITING A FILM VERSUM MATERIALS US, LLC (US) 2021-07-01 WO disclosed
WO-2021050368-A1 COMPOSITIONS AND METHODS USING SAME FOR NON-CONFORMAL DEPOSITION OF SILICON-CONTAINING FILMS VERSUM MATERIALS US, LLC (US) 2021-03-18 WO disclosed
US-20200308416-A1 Compositions And Methods For The Deposition Of Silicon Oxide Films VERSUM MATERIALS US, LLC (US) 2020-10-01 US disclosed
US-10703915-B2 Compositions and methods for the deposition of silicon oxide films VERSUM MATERIALS US, LLC (US) 2020-07-07 US disclosed
US-20200040192-A9 Compositions and Methods for the Deposition of Silicon Oxide Films VERSUM MATERIALS US, LLC (US) 2020-02-06 US disclosed
US-20180127592-A1 Compositions and Methods for the Deposition of Silicon Oxide Films VERSUM MATERIALS US, LLC (US) 2018-05-10 US disclosed
US-20180127592-A1 Compositions and Methods for the Deposition of Silicon Oxide Films VERSUM MATERIALS US, LLC (US) 2018-05-10 US disclosed