Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | PARP10 | Q53GL7 | 1/20 | 0.47 |
| ▸ | HRH1 | P35367 | 2/20 | 0.43 |
| ▸ | ROCK1 | Q13464 | 1/20 | 0.41 |
| ▸ | FURIN | P09958 | 2/20 | 0.40 |
| ▸ | MAP4K4 | O95819 | 1/20 | 0.40 |
| ▸ | HRH3 | Q9Y5N1 | 2/20 | 0.39 |
| ▸ | KDM1A | O60341 | 1/20 | 0.39 |
| ▸ | PTPN1 | P18031 | 1/20 | 0.39 |
| ▸ | SLC6A4 | P31645 | 3/20 | 0.38 |
| ▸ | SLC6A2 | P23975 | 1/20 | 0.38 |
| ▸ | SLC6A3 | Q01959 | 1/20 | 0.38 |
| ▸ | EPHX2 | P34913 | 3/20 | 0.38 |
| ▸ | SENP8 | Q96LD8 | 1/20 | 0.37 |
| ▸ | SENP6 | Q9GZR1 | 1/20 | 0.37 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.37 |
| ▸ | TSHR | P16473 | 1/20 | 0.37 |
| ▸ | F2 | P00734 | 1/20 | 0.36 |
| ▸ | PRSS1 | P07477 | 1/20 | 0.36 |
| ▸ | PRSS2 | P07478 | 1/20 | 0.36 |
| ▸ | PRSS3 | P35030 | 1/20 | 0.36 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL17324128 | 0.89 | TEAD4 (0.42) | PARP10HRH1ROCK1HRH3KDM1A | |
| SCHEMBL13478355 | 0.89 | SLC6A4 (0.53) | PARP10SLC6A4SLC6A2SLC6A3EPHX2 | |
| SCHEMBL8597767 | 0.89 | TEAD4 (0.42) | PARP10HRH1ROCK1HRH3KDM1A | |
| SCHEMBL15573563 | 0.89 | SLC6A4 (0.53) | PARP10SLC6A4SLC6A2SLC6A3EPHX2 | |
| SCHEMBL1065750 | 0.89 | EPHX2 (0.50) | PARP10EPHX2 | |
| SCHEMBL1065749 | 0.89 | EPHX2 (0.50) | PARP10EPHX2 | |
| SCHEMBL15574818 | 0.89 | EPHX2 (0.50) | PARP10EPHX2 | |
| SCHEMBL2647851 | 0.89 | HRH1 (0.59) | PARP10HRH1KDM1ASLC6A4SLC6A2 | |
| SCHEMBL2647849 | 0.89 | HRH1 (0.59) | PARP10HRH1KDM1ASLC6A4SLC6A2 | |
| Hydrochloric Acid SCHEMBL14631337 | 0.87 | HRH1 (0.57) | PARP10HRH1KDM1ASLC6A4SLC6A2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 37 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20200071569-A1 | METHOD OF PRODUCING JOINED BODY, COMPOSITION FOR TRANSIENT LIQUID PHASE SINTERING, SINTERED BODY, AND JOINED BODY | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2020-03-05 | — | — | US | disclosed |
| US-20200071488-A1 | COMPOSITION, ADHESIVE, SINTERED BODY, JOINED BODY, AND METHOD OF PRODUCING JOINED BODY | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2020-03-05 | — | — | US | disclosed |
| US-20200063008-A1 | COMPOSITION, ADHESIVE, SINTERED BODY, JOINED BODY, AND METHOD OF PRODUCING JOINED BODY | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2020-02-27 | — | — | US | disclosed |
| EP-1627901-B1 | PRIMER, CONDUCTOR FOIL WITH RESIN, LAMINATE AND PROCESS FOR PRODUCING THE LAMINATE | HITACHI CHEMICAL CO LTD (JP) | 2020-02-19 | — | — | EP | disclosed |
| US-20190300651-A1 | COMPOSITION, ADHESIVE, SINTERED BODY, JOINED BODY, AND METHOD OF PRODUCING JOINED BODY | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2019-10-03 | — | — | US | disclosed |
| EP-2886339-B1 | RESIN SHEET, SUPPORT BODY WITH RESIN LAYER, LAMINATE PLATE, AND METAL-CLAD LAMINATE PLATE | MITSUBISHI GAS CHEMICAL CO (JP) | 2017-03-01 | — | — | EP | disclosed |
| US-20150210832-A1 | RESIN SHEET, SUPPORT WITH RESIN LAYER, LAMINATE AND METAL FOIL-CLAD LAMINATE | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2015-07-30 | — | — | US | disclosed |
| EP-2886339-A1 | RESIN SHEET, SUPPORT BODY WITH RESIN LAYER, LAMINATE PLATE, AND METAL-CLAD LAMINATE PLATE | Mitsubishi Gas Chemical Company, Inc. (JP) | 2015-06-24 | — | — | EP | disclosed |
| US-20150056454-A1 | RESIN COMPOSITION, PREPREG, AND METAL FOIL-CLAD LAMINATE | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2015-02-26 | — | — | US | disclosed |
| US-8956732-B2 | Polyamideimide resin, adhesive agent, material for flexible substrate, flexible laminate, and flexible print wiring board | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2015-02-17 | — | — | US | disclosed |
| US-7629045-B2 | Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2009-12-08 | — | — | US | disclosed |
| US-7615277-B2 | Formation method of metal layer on resin layer, printed wiring board, and production method thereof | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2009-11-10 | — | — | US | disclosed |
| EP-2070961-A1 | POLYAMIDEIMIDE RESIN, ADHESIVE AGENT, MATERIAL FOR FLEXIBLE SUBSTRATE, FLEXIBLE LAMINATE, AND FLEXIBLE PRINT WIRING BOARD | Hitachi Chemical Company, Ltd. (JP) | 2009-06-17 | — | — | EP | disclosed |
| US-20090145766-A1 | ADHESION ASSISTING AGENT-BEARING METAL FOIL, PRINTED WIRING BOARD, AND PRODUCTION METHOD OF PRINTED WIRING BOARD | RESONAC CORPORATION (JP) | 2009-06-11 | — | — | US | disclosed |
| US-20080138505-A1 | FORMATION METHOD OF METAL LAYER ON RESIN LAYER, PRINTED WIRING BOARD, AND PRODUCTION METHOD THEREOF | TAKAI KENJI | 2008-06-12 | — | — | US | disclosed |
| US-20070277373-A1 | FORMATION METHOD OF METAL LAYER ON RESIN LAYER, PRINTED WIRING BOARD, AND PRODUCUTION METHOD THEREOF | RESONAC CORPORATION (JP) | 2007-12-06 | — | — | US | disclosed |
| US-20070185297-A1 | Primer, conductor foil with resin, laminated sheet and method of manufacturing laminated sheet | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2007-08-09 | — | — | US | disclosed |
| EP-1627901-A1 | PRIMER, CONDUCTOR FOIL WITH RESIN, LAMINATE AND PROCESS FOR PRODUCING THE LAMINATE | Hitachi Chemical Co., Ltd. (JP) | 2006-02-22 | — | — | EP | disclosed |
| US-20050202261-A1 | Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board | RESONAC CORPORATION (JP) | 2005-09-15 | — | — | US | disclosed |
| US-20050106370-A1 | Formation method of metal layer on resin layer, printed wiring board, and production method thereof | HITACHI CHEMICAL CO., LTD. (JP) | 2005-05-19 | — | — | US | disclosed |